Zhong Chao, Wang Likun, Qin Lei, Zhang Yanjun
Beijing University of Posts and Telecommunications, Beijing - China.
Beijing Key Laboratory for Sensor, Beijing Information Science and Technology University, Beijing - China.
J Appl Biomater Funct Mater. 2017 Jun 16;15(Suppl. 1):e38-e44. doi: 10.5301/jabfm.5000365.
To increase electromechanical coupling factor of 1-3 piezoelectric composite and reduce its bending deformation under external stress, an improved 1-3 piezoelectric composite is developed. In the improved structure, both epoxy resin and silicone rubber are used as polymer material.
The simulation model of the improved 1-3 piezoelectric composite was established using the finite element software ANSYS. The relationship of the performance of the improved composite to the volume percentage of silicone rubber was determined by harmonic response analysis and the bending deformation under external stress was simulated by static analysis. The improved composite samples were prepared by cutting and filling methods, and the performance was tested.
The feasibility of the improved structure was verified by finite element simulation and experiment. The electromechanical coupling factor of the improved composite can reach 0.67 and meanwhile the characteristic impedance can decline to 13 MRayl. The electromechanical coupling factor of the improved composite is higher than that of the composite with only epoxy resin as the polymer and the improved composite can reduce bending deformation.
Comparison of simulation and experiment, the results of the experiment are in general agreement with those from the simulation. However, most experimental values were higher than the simulation results, and the abnormality of the test results was also more obvious than that of the simulation. These findings may be attributed to slight difference in the material parameters of simulation and experiment.
为提高1-3型压电复合材料的机电耦合系数并降低其在外力作用下的弯曲变形，开发了一种改进的1-3型压电复合材料。在改进结构中，环氧树脂和硅橡胶均用作聚合物材料。
使用有限元软件ANSYS建立改进的1-3型压电复合材料的仿真模型。通过谐响应分析确定改进复合材料的性能与硅橡胶体积百分比之间的关系，并通过静态分析模拟其在外力作用下的弯曲变形。采用切割和填充方法制备改进的复合材料样品，并对其性能进行测试。
通过有限元模拟和实验验证了改进结构的可行性。改进复合材料的机电耦合系数可达0.67，同时特性阻抗可降至13兆瑞利。改进复合材料的机电耦合系数高于仅以环氧树脂为聚合物的复合材料，且改进复合材料可减少弯曲变形。
模拟与实验结果对比，实验结果与模拟结果总体一致。然而，大多数实验值高于模拟结果，且测试结果的异常情况也比模拟结果更明显。这些发现可能归因于模拟和实验材料参数的细微差异。
