Hera Daniel, Berndt Armin, Günther Thomas, Schmiel Stephan, Harendt Christine, Zimmermann André
Institute for Micro Assembly Technology, Hahn-Schickard e. V, Allmandring 9B, 70569 Stuttgart, Germany.
Institut für Mikroelektronik Stuttgart, Allmandring 30a, 70569 Stuttgart, Germany.
Sensors (Basel). 2017 Jun 27;17(7):1511. doi: 10.3390/s17071511.
Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low-volume production are the main requirements for future solutions in packaging. This study investigates possibilities employing printed circuit board (PCB-)based assemblies to provide high flexibility for circuit designs together with film assisted transfer molding (FAM) to package sensors. The feasibility of FAM in combination with PCB and MEMS as a packaging technology for highly sensitive inertia sensors is being demonstrated. The results prove the technology to be a viable method for damage-free packaging of stress- and pressure-sensitive MEMS.
封装是基于微机电系统（MEMS）的传感器微集成中的一个重要部分。除了小型化和集成密度外，功能和可靠性，以及在适度成本下封装设计的灵活性，进而实现高混合、小批量生产，是未来封装解决方案的主要要求。本研究探讨了采用基于印刷电路板（PCB）的组件为电路设计提供高灵活性，以及结合薄膜辅助传递模塑（FAM）来封装传感器的可能性。正在证明FAM与PCB和MEMS相结合作为高灵敏度惯性传感器封装技术的可行性。结果证明该技术是一种用于无损封装应力和压力敏感MEMS的可行方法。
