Materials Architecturing Research Center, Korea Institute of Science and Technology, 5, Hwarang-ro 14-gil, Seongbuk-gu, Seoul 02792, Republic of Korea.
Nanoscale. 2017 Sep 21;9(36):13432-13440. doi: 10.1039/c7nr02618h.
Lightweight dual-functional materials with high EMI shielding performance and thermal conductivity are of great importance in modern cutting-edge applications, such as mobile electronics, automotive, aerospace, and military. Unfortunately, a clear material solution has not emerged yet. Herein, we demonstrate a simple and effective way to fabricate lightweight metal-based polymer composites with dual-functional ability of excellent EMI shielding effectiveness and thermal conductivity using expandable polymer bead-templated Cu hollow beads. The low-density Cu hollow beads (ρ ∼ 0.44 g cm) were fabricated through electroless plating of Cu on the expanded polymer beads with ultralow density (ρ ∼ 0.02 g cm). The resulting composites that formed a continuous 3D Cu network with a very small Cu content (∼9.8 vol%) exhibited excellent EMI shielding (110.7 dB at 7 GHz) and thermal conductivity (7.0 W m K) with isotropic features. Moreover, the densities of the composites are tunable from 1.28 to 0.59 g cm in accordance with the purpose of their applications. To the best of our knowledge, the resulting composites are the best lightweight dual-functional materials with exceptionally high EMI SE and thermal conductivity performance among synthetic polymer composites.
具有高电磁屏蔽性能和导热性能的轻质双功能材料在现代前沿应用中非常重要，例如移动电子、汽车、航空航天和军事。不幸的是，目前还没有明确的材料解决方案。在此，我们展示了一种简单而有效的方法，使用可膨胀聚合物珠模板化的 Cu 空心珠来制备具有优异电磁屏蔽效能和导热性能的轻质金属基聚合物复合材料。通过在超低密度（ρ∼0.02 g cm）的膨胀聚合物珠上进行化学镀 Cu，制备出低密度 Cu 空心珠（ρ∼0.44 g cm）。所得复合材料形成具有非常小的 Cu 含量（∼9.8 体积%）的连续 3D Cu 网络，具有各向同性特征，表现出优异的电磁屏蔽（在 7 GHz 时为 110.7 dB）和导热性能（7.0 W m K）。此外，复合材料的密度可以根据应用目的从 1.28 调至 0.59 g cm。据我们所知，所得复合材料是合成聚合物复合材料中具有极高电磁屏蔽效能和导热性能的最佳轻质双功能材料。
