Department of Mechanical Engineering, École Polytechnique de Montréal , 2900 boulevard Édouard-Montpetit, Montréal, Québec H3T 1J4, Canada.
Department of Engineering Physics, École Polytechnique de Montréal , 2900 boulevard Édouard-Montpetit, Montréal, Québec H3T 1J4, Canada.
ACS Appl Mater Interfaces. 2017 Aug 30;9(34):29010-29020. doi: 10.1021/acsami.7b06526. Epub 2017 Aug 16.
Noble-metal-coated carbon-based nanoparticles, when used as electrically conductive fillers, have the potential to provide excellent conductivity without the high weight and cost normally associated with metals such as silver and gold. To this effect, many attempts were made to deposit uniform metallic layers on core nanoparticles with an emphasis on silver for its high conductivity. The results so far were disheartening with the metal morphology being better described as a decoration than a coating with small effects on the electrical conductivity of the bulk particles. We tackled in this work the specific problem of electroless deposition of silver on carbon nanofibers (CNFs) with the investigation of every step of the process. We performed X-ray photoelectron spectroscopy (XPS), transmission and scanning electron microscopy (TEM, SEM), zeta potential, and electrical conductivity measurements to identify a repeatable, reliable set of parameters allowing for a uniform and fully connected silver deposition on the surface of the CNFs. The bulk particles' specific electrical conductivity (conductivity per unit mass) undergoes a more than 10-fold increase during the deposition, reaching 2500 S·cm/g, which indicates that the added metal mass participates efficiently to the conduction network. The particles keep their high aspect ratio through the process, which enables a percolated conduction network at very low volume loadings in a composite. No byproducts are produced during the reaction so the particles do not have to be sorted or purified and can be used as produced after the short ∼15 min reaction time. The particles might be an interesting replacement to conventional fillers in isotropic conductive adhesives, as a conductive network is obtained at a much lower loading. They might also serve as electrically conductive fillers in composites where a high conductivity is needed, such as lightning strike protection systems, or as high surface area silver electrodes.
基于碳的纳米颗粒涂覆贵金属后,作为导电填料,有望在不增加重量和成本的情况下提供优异的导电性,通常金属如银和金都会有这样的问题。为此,人们尝试了很多方法在核纳米颗粒上沉积均匀的金属层,特别关注银,因为它的导电性很高。到目前为止,结果令人沮丧,金属形态与其说是涂层,不如说是一种装饰,对整体颗粒的电导率影响很小。在这项工作中,我们解决了在碳纳米纤维(CNF)上电沉积银的具体问题,并研究了该过程的每一步。我们进行了 X 射线光电子能谱(XPS)、透射电子显微镜(TEM)和扫描电子显微镜(SEM)、Zeta 电位和电导率测量,以确定一组可重复、可靠的参数,使银能够在 CNF 表面实现均匀、完全的沉积。在沉积过程中,整体颗粒的比电导率(单位质量的电导率)增加了 10 倍以上,达到 2500 S·cm/g,这表明添加的金属质量有效地参与了导电网络。在整个过程中,颗粒保持其高纵横比,从而在复合材料中以非常低的体积负载实现了渗流导电网络。反应过程中没有副产物生成,因此颗粒无需进行分类或纯化,可以在短至 15 分钟的反应时间后直接使用。这些颗粒可能是各向同性导电胶中传统填料的替代品,因为在更低的负载下就可以获得导电网络。它们也可以作为需要高导电性的复合材料中的导电填料,例如雷击保护系统,或用作高表面积的银电极。