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Ag 和 CuO 在 Cu 纳米颗粒上的修饰用于增强对有机污染物的高催化活性。

Decorating of Ag and CuO on Cu Nanoparticles for Enhanced High Catalytic Activity to the Degradation of Organic Pollutants.

机构信息

College of Environmental Science and Engineering, North China Electric Power University , Beijing 102206, PR China.

出版信息

Langmuir. 2017 Aug 8;33(31):7606-7614. doi: 10.1021/acs.langmuir.7b01540. Epub 2017 Jul 31.

Abstract

Metal/semiconductor composites are promising catalysts with superior catalytic activity. In this work, a Cu/CuO-Ag composite with structure that consisted of Ag and CuO nanoparticles (NPs) decorated on the surface of Cu were fabricated via a facile in situ method. With characterization by transmission electron microscopy (TEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), energy dispersive X-ray spectroscopy (EDX), and inductively coupled plasma atomic emission spectrometry (ICP-AES), the structure and components of the Cu/CuO-Ag composite were well-defined. The Cu/CuO-Ag composite exhibited superior catalytic activities for the reduction of 4-nitrophenol (4-NP) in the presence of NaBH with just a trace amount of Ag NPs (1.28 wt %). The reduction reaction is completed in 75 s with an apparent rate constant k of 4.60 × 10 s. The Cu/CuO-Ag composite also showed excellent durable catalytic stability, as no significant activity loss was detected in the consecutive five reaction runs. With the aid of the Sabatier principle and volcano plot, the opportune chemical adsorption energy of the reagent 4-NP on the Cu/CuO-Ag composite was inferred to be the key to its high reaction rate. The CuO NPs as a semiconductor with narrow band gap also could help the Cu/CuO-Ag composite to capture the electrons/hydride ions and increase opportunities for 4-NP to be reduced. Furthermore, the Cu/CuO-Ag composite exhibited outstanding activity on the oxidative degradation of methylene blue (MB). This work enriched the bimetal/semiconductor catalyst system and supplied new insight into the catalysis mechanism.

摘要

金属/半导体复合材料是一种具有优异催化活性的有前途的催化剂。在这项工作中,通过一种简便的原位方法制备了一种由 Ag 和 CuO 纳米颗粒 (NPs) 修饰在 Cu 表面的 Cu/CuO-Ag 复合材料,其结构由透射电子显微镜 (TEM)、X 射线衍射 (XRD)、X 射线光电子能谱 (XPS)、能谱 (EDX) 和电感耦合等离子体原子发射光谱 (ICP-AES) 进行了表征。Cu/CuO-Ag 复合材料的结构和成分得到了很好的定义。Cu/CuO-Ag 复合材料在痕量 Ag NPs(1.28wt%)存在下,对硼氢化钠还原 4-硝基苯酚 (4-NP) 具有优异的催化活性。还原反应在 75 秒内完成,表观速率常数 k 为 4.60×10 s。Cu/CuO-Ag 复合材料还表现出优异的耐用催化稳定性,在连续五次反应中没有检测到明显的活性损失。借助 Sabatier 原理和火山图,推断出试剂 4-NP 在 Cu/CuO-Ag 复合材料上的适宜化学吸附能是其高反应速率的关键。具有窄带隙的 CuO NPs 作为半导体也可以帮助 Cu/CuO-Ag 复合材料捕获电子/氢化物离子,并增加 4-NP 还原的机会。此外,Cu/CuO-Ag 复合材料对亚甲基蓝 (MB) 的氧化降解表现出出色的活性。这项工作丰富了双金属/半导体催化剂体系,并为催化机制提供了新的见解。

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