Zhang Dongdong, Bai Fang, Sun Liping, Wang Yong, Wang Jinguo
Key Laboratory of Automobile Materials of Ministry of Education, Department of Materials Science and Engineering, Jilin University, Changchun 130025, China.
Cosco Logistics (Beijing) Materials Co., Ltd., No. 3 Maizidian West Road, Beijing 100016, China.
Materials (Basel). 2017 May 4;10(5):499. doi: 10.3390/ma10050499.
The compression properties and electrical conductivity of in-situ 20 vol.% nano-sized TiC/Cu composites fabricated via combustion synthesis and hot press in Cu-Ti-CNTs system at various particles size and morphology were investigated. Cubic-TiC/Cu composite had higher ultimate compression strength (σ), yield strength (σ), and electric conductivity, compared with those of spherical-TiC/Cu composite. The σ, σ, and electrical conductivity of cubic-TiC/Cu composite increased by 4.37%, 20.7%, and 17.8% compared with those of spherical-TiC/Cu composite (526 MPa, 183 MPa, and 55.6% International Annealed Copper Standard, IACS). Spherical-TiC/Cu composite with average particle size of ~94 nm exhibited higher ultimate compression strength, yield strength, and electrical conductivity compared with those of spherical-TiC/Cu composite with 46 nm in size. The σ, σ, and electrical conductivity of spherical-TiC/Cu composite with average size of ~94 nm in size increased by 17.8%, 33.9%, and 62.5% compared with those of spherical-TiC/Cu composite (417 MPa, 121 MPa, and 40.3% IACS) with particle size of 49 nm, respectively. Cubic-shaped TiC particles with sharp corners and edges led to stress/strain localization, which enhanced the compression strength of the composites. The agglomeration of spherical-TiC particles with small size led to the compression strength reduction of the composites.
研究了在Cu-Ti-CNTs体系中通过燃烧合成和热压制备的体积分数为20%的原位纳米TiC/Cu复合材料在不同颗粒尺寸和形态下的压缩性能和电导率。与球形TiC/Cu复合材料相比,立方TiC/Cu复合材料具有更高的极限压缩强度(σ)、屈服强度(σ)和电导率。立方TiC/Cu复合材料的σ、σ和电导率与球形TiC/Cu复合材料(526MPa、183MPa和55.6%国际退火铜标准,IACS)相比分别提高了4.37%、20.7%和17.8%。平均粒径约为94nm的球形TiC/Cu复合材料比粒径为46nm的球形TiC/Cu复合材料具有更高的极限压缩强度、屈服强度和电导率。平均粒径约为94nm的球形TiC/Cu复合材料的σ、σ和电导率与粒径为49nm的球形TiC/Cu复合材料(417MPa、121MPa和40.3%IACS)相比分别提高了17.8%、33.9%和62.5%。具有尖角和棱边的立方体形TiC颗粒导致应力/应变局部化,从而提高了复合材料的压缩强度。小尺寸球形TiC颗粒的团聚导致复合材料的压缩强度降低。