Chen Cong, Zhai Zhenjie, Sun Changfei, Wang Zhe, Li Denghui
School of Physics and Electronic Information Engineering, Qinghai Minzu University, Xining 810007, China.
Qinghai Key Laboratory of Nanomaterials and Technology, Xining 810007, China.
Nanomaterials (Basel). 2024 Feb 24;14(5):418. doi: 10.3390/nano14050418.
Among the various reinforcement phases available in Cu-based composites, the unique layered structure and easy diffusion of A-layer atoms make MAX phases more suitable for reinforcing a copper matrix than others. In this study, Cu-coated TiAlC particles (Cu@TiAlC) were prepared through electroless plating, and Cu@TiAlC/Cu composites were fabricated via vacuum hot-press sintering. The phase composition and microstructure of both Cu@TiAlC powder and composites were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The results demonstrate the creation of successful electroless copper plating to obtain a Cu coating on TiAlC particles. At 850 °C, a small amount of TiAlC particles decompose to form TiCx, while Al atoms from the A layer of MAX phase diffuse into the Cu matrix to form a solid solution with Cu(Al). The test results reveal that the density of the Cu@TiAlC/Cu composite reaches 98.5%, with a maximum compressive strength of 705 MPa, which is 8.29% higher than that of the TiAlC/Cu composite. Additionally, the compressive strain reaches 37.6%, representing an increase of 12.24% compared to that exhibited by the TiAlC/Cu composite.
在铜基复合材料中可用的各种增强相中,MAX相独特的层状结构和A层原子易于扩散的特性使其比其他相更适合增强铜基体。在本研究中,通过化学镀制备了铜包覆的TiAlC颗粒(Cu@TiAlC),并通过真空热压烧结制备了Cu@TiAlC/Cu复合材料。使用X射线衍射(XRD)、扫描电子显微镜(SEM)和透射电子显微镜(TEM)对Cu@TiAlC粉末和复合材料的相组成和微观结构进行了表征。结果表明成功进行了化学镀铜,在TiAlC颗粒上获得了铜涂层。在850℃时,少量的TiAlC颗粒分解形成TiCx,而MAX相A层中的Al原子扩散到铜基体中与Cu(Al)形成固溶体。测试结果表明,Cu@TiAlC/Cu复合材料的密度达到98.5%,最大抗压强度为705MPa,比TiAlC/Cu复合材料高8.29%。此外,压缩应变达到37.6%,比TiAlC/Cu复合材料所表现出的应变增加了12.24%。