CuZnAl颗粒对Sn-58Bi焊料性能及微观结构的影响

Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder.

作者信息

Yang Fan, Zhang Liang, Liu Zhi-Quan, Zhong Su Juan, Ma Jia, Bao Li

机构信息

School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China.

Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China.

出版信息

Materials (Basel). 2017 May 19;10(5):558. doi: 10.3390/ma10050558.

DOI:10.3390/ma10050558

PMID:28772917

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC5458988/

Abstract

With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles. When the addition of CuZnAl particles was 0.2 wt %, the wettability of the Sn-58Bi solder performed best. At the same time, excessive addition of CuZnAl particles led to poor wettability. However, the results showed that CuZnAl particles changed the melting point of the Sn-58Bi solder slightly. The microstructure of the Sn-58Bi solder was refined by adding CuZnAl particles. When the content of CuZnAl addition was between 0.1 and 0.2 wt %, the refinement was great. In addition, the interfacial IMC layer between new composite solder and Cu substrate was thinner than that between the Sn-58Bi solder and Cu substrate.

摘要

为了改善Sn-58Bi无铅焊料的性能，将含量为0至0.4 wt%的微米级CuZnAl颗粒添加到低温共晶Sn-58Bi无铅焊料中。通过对微米级CuZnAl颗粒对Sn-58Bi焊料性能和微观结构的实验测试发现，添加CuZnAl颗粒后，Sn-58Bi焊料的润湿性明显提高。当CuZnAl颗粒的添加量为0.2 wt%时，Sn-58Bi焊料的润湿性最佳。同时，过量添加CuZnAl颗粒会导致润湿性变差。然而，结果表明CuZnAl颗粒对Sn-58Bi焊料的熔点影响较小。添加CuZnAl颗粒使Sn-58Bi焊料的微观结构得到细化。当CuZnAl添加量在0.1至0.2 wt%之间时，细化效果显著。此外，新型复合焊料与Cu基板之间的界面IMC层比Sn-58Bi焊料与Cu基板之间的界面IMC层更薄。