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电子封装中低温无铅焊料的微观结构与性能综述

Review of microstructure and properties of low temperature lead-free solder in electronic packaging.

作者信息

Xu Kai-Kai, Zhang Liang, Gao Li-Li, Jiang Nan, Zhang Lei, Zhong Su-Juan

机构信息

School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, Jiangsu, China.

State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, Heilongjiang, China.

出版信息

Sci Technol Adv Mater. 2020 Oct 19;21(1):689-711. doi: 10.1080/14686996.2020.1824255.

DOI:10.1080/14686996.2020.1824255
PMID:33177953
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7594718/
Abstract

Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders.

摘要

低温焊料（铟基、锡铋、锡锌）由于其独特的低温特性，在航空航天以及IBM大型机的通孔技术组件中具有很大优势。本综述评估了合金元素、稀土元素和纳米颗粒对低温焊料的润湿性、微观结构、机械性能和抗氧化性的影响。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/feb1614bc6f1/TSTA_A_1824255_F0012_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/d9fc8779a2cf/TSTA_A_1824255_UF0001_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/88464584af90/TSTA_A_1824255_F0001_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/7c58d307f425/TSTA_A_1824255_F0002_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/65e00ae31a57/TSTA_A_1824255_F0003_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/ae6813af0aec/TSTA_A_1824255_F0004_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/6e8b25121d96/TSTA_A_1824255_F0005_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/0357c9601590/TSTA_A_1824255_F0006_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/c4bf3079f143/TSTA_A_1824255_F0007_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/d0f6ead9ccf6/TSTA_A_1824255_F0008_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/2e96a7eb7c72/TSTA_A_1824255_F0009_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/69f55d75a7a3/TSTA_A_1824255_F0010_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/089e8ba7687c/TSTA_A_1824255_F0011_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/feb1614bc6f1/TSTA_A_1824255_F0012_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/d9fc8779a2cf/TSTA_A_1824255_UF0001_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/88464584af90/TSTA_A_1824255_F0001_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/7c58d307f425/TSTA_A_1824255_F0002_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/65e00ae31a57/TSTA_A_1824255_F0003_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/ae6813af0aec/TSTA_A_1824255_F0004_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/6e8b25121d96/TSTA_A_1824255_F0005_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/0357c9601590/TSTA_A_1824255_F0006_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/c4bf3079f143/TSTA_A_1824255_F0007_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/d0f6ead9ccf6/TSTA_A_1824255_F0008_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/2e96a7eb7c72/TSTA_A_1824255_F0009_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/69f55d75a7a3/TSTA_A_1824255_F0010_OC.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/089e8ba7687c/TSTA_A_1824255_F0011_B.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/568c/7594718/feb1614bc6f1/TSTA_A_1824255_F0012_B.jpg

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