生长速率和磁场对定向凝固Ag-Cu共晶合金微观结构及性能的影响

Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy.

作者信息

Zuo Xiaowei, Zhao Congcong, Zhang Lin, Wang Engang

机构信息

Key Laboratory of Electromagnetic Processing of Materials (Ministry of Education), Northeastern University, Shenyang 110004, China.

School of Metallurgy, Northeastern University, Shenyang 110004, China.

出版信息

Materials (Basel). 2016 Jul 13;9(7):569. doi: 10.3390/ma9070569.

DOI:10.3390/ma9070569

PMID:28773691

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC5456848/

Abstract

We report the influence of growth rate and external magnetic field on the eutectic lamellar spacing and properties of directionally-solidified Ag-Cu eutectic alloys. The results indicated that the relationship between the lamellar spacing of directionally-solidified Ag-Cu alloys and the growth rate matched the prediction of the Jackson-Hunt model, and the constant was 5.8 µm³/s. The increasing external magnetic field during solidification tilted the growth direction of the lamellar eutectics, and coarsened the eutectic lamellar spacing. These decreased the microhardness and strength of Ag-Cu alloys, but increased their electrical conductivity. The competitive strengthening contributions between the refinement of the eutectic lamellar spacing and the change in growth direction of the eutectics resulted in higher strength in the as-rolled sample with a 0.8 T magnetic field than with other samples, which was confirmed from higher relieved deformation energy using differential scanning calorimetry.

摘要

我们报道了生长速率和外部磁场对定向凝固Ag-Cu共晶合金的共晶层片间距及性能的影响。结果表明，定向凝固Ag-Cu合金的层片间距与生长速率之间的关系符合Jackson-Hunt模型的预测，常数为5.8 µm³/s。凝固过程中外部磁场增强会使层片共晶的生长方向倾斜，并使共晶层片间距粗化。这些变化降低了Ag-Cu合金的显微硬度和强度，但提高了其电导率。共晶层片间距细化与共晶生长方向变化之间的竞争强化作用，导致在0.8 T磁场下轧制后的样品比其他样品具有更高的强度，这通过差示扫描量热法测得的更高的弛豫变形能得到了证实。