Zhao Degang, Ning Jiai, Wu Di, Zuo Min
School of Materials Science and Engineering, University of Jinan, 336 Nan-Xinzhuang West Road, Jinan 250022, China.
Materials (Basel). 2016 Jul 28;9(8):629. doi: 10.3390/ma9080629.
In this study, nano-sized fullerene C powder was sufficiently mixed with Cu₂SnSe₃ powder by ball milling method, and the C/Cu₂SnSe₃ composites were prepared by spark plasma sintering technology. The fullerene C distributed uniformly in the form of clusters, and the average cluster size was less than 1 μm. With increasing C content, the electrical conductivity of C/Cu₂SnSe₃ composites decreased, while the Seebeck coefficient was enhanced. The thermal conductivity of composites decreased significantly, which resulted from the phonon scattering by the C clusters located on the grain boundaries of the Cu₂SnSe₃ matrix. The highest figure of merit of 0.38 was achieved at 700 K for 0.8% C/Cu₂SnSe₃ composite.
在本研究中,通过球磨法将纳米尺寸的富勒烯C粉末与Cu₂SnSe₃粉末充分混合,并采用放电等离子烧结技术制备了C/Cu₂SnSe₃复合材料。富勒烯C以团簇形式均匀分布,平均团簇尺寸小于1μm。随着C含量的增加,C/Cu₂SnSe₃复合材料的电导率降低,而塞贝克系数增强。复合材料的热导率显著降低,这是由于位于Cu₂SnSe₃基体晶界上的C团簇对声子的散射所致。对于0.8%的C/Cu₂SnSe₃复合材料,在700K时实现了最高品质因数0.38。