Division of Advanced Nanomaterials, Key Laboratory of Nanodevices and Applications, CAS Center for Excellence in Nanoscience, Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences , Suzhou 215123, China.
School of Nano Technology and Nano Bionics, University of Science and Technology of China , Hefei 230026, China.
ACS Appl Mater Interfaces. 2017 Aug 30;9(34):29047-29054. doi: 10.1021/acsami.7b07045. Epub 2017 Aug 17.
Electrically conductive adhesives (ECAs) can be regarded as one of the most promising materials to replace tin/lead solder. However, relatively low conductivity seriously restricts their applications. In the present study, we develop an effective method to decrease the bulk electrical resistivity of ECAs. KI or KBr is added to replace the lubricant and silver oxide layers on silver flakes and to form photosensitive silver halide. After exposure to sunlight, silver halide can photodecompose into silver nanoparticles that will sinter and form metallic bonding between/among flakes during the curing process of ECAs, which would remarkably reduce the resistivity. The modified micro silver flakes play a crucial role in decreasing the electrical resistivity of the corresponding ECAs, exhibiting the lowest resistivity of 7.6 × 10 Ω·cm for 70 wt % loaded ECAs. The obtained ECAs can have wide applications in the electronics industry, where high conductance is required.
导电胶（ECA）可以被视为最有前途的替代锡/铅焊料的材料之一。然而，相对较低的导电性严重限制了它们的应用。在本研究中，我们开发了一种降低 ECA 体电阻率的有效方法。KI 或 KBr 被添加到银片上来取代润滑剂和氧化银层，并形成光敏卤化银。在暴露于阳光下后，卤化银可以光分解成银纳米粒子，这些纳米粒子将在 ECA 的固化过程中烧结，并在片层之间形成金属键合，从而显著降低电阻率。改性后的微银片在降低相应 ECA 的电阻率方面起着至关重要的作用，对于 70wt%负载的 ECA，其电阻率最低可达 7.6×10 Ω·cm。所得到的 ECA 可以在需要高导电性的电子行业中得到广泛应用。
