State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
ACS Appl Mater Interfaces. 2017 Aug 30;9(34):28558-28565. doi: 10.1021/acsami.7b08121. Epub 2017 Aug 17.
The effect of Al-, Ga-, and In-doping on the thermoelectric (TE) properties of CuSbSe has been comparatively studied on the basis of theoretical prediction and experimental validation. It is found that tiny Al/Ga/In substitution leads to a great enhancement of electrical conductivity with high carrier concentration and also large Seebeck coefficient due to the preserved high band degeneracy and thereby a remarkably high power factor. Ultimately, coupled with the depressed lattice thermal conductivity, all three elements (Al/Ga/In) substituted samples have obtained a highly improved thermoelectric performance with respect to undoped CuSbSe. Compared to the samples at the same Al/In doping level, the slightly Ga-doped sample presents better TE performance over the wide temperature range, and the CuSbGaSe sample presents a record high ZT value of 0.9 among single-doped CuSbSe at 623 K, which is about 80% higher than that of pristine CuSbSe. This work offers an alternative approach to boost the TE properties of CuSbSe by selecting efficient dopant to weaken the coupling between electrical conductivity and Seebeck coefficient.
基于理论预测和实验验证,比较研究了 Al、Ga 和 In 掺杂对 CuSbSe 热电(TE)性能的影响。结果发现,由于高能带简并度得以保留,微量的 Al/Ga/In 取代会导致载流子浓度增加,电导率显著提高,同时塞贝克系数也较大,从而获得了很高的功率因子。最终,再加上晶格热导率的降低,所有三种元素(Al/Ga/In)取代的样品相对于未掺杂的 CuSbSe 都获得了极高的热电性能。与相同 Al/In 掺杂水平的样品相比,略 Ga 掺杂的样品在较宽的温度范围内表现出更好的 TE 性能,CuSbGaSe 样品在 623 K 时的 ZT 值达到了 0.9,创下了单掺杂 CuSbSe 的记录,比原始 CuSbSe 高约 80%。这项工作提供了一种通过选择有效的掺杂剂来减弱电导率和塞贝克系数之间的耦合来提高 CuSbSe 的 TE 性能的替代方法。