Tripathi Arvind, Bagchi Soumyojeet, Singh Juhi
Dean Postgraduate Studies and Research, Saraswati Dental College and Hospital, Lucknow, India.
Junior resident, Dept. of Prosthodontics, Saraswati Dental College and Hospital, Lucknow, India.
J Prosthodont. 2018 Apr;27(4):355-360. doi: 10.1111/jopr.12497. Epub 2017 Aug 21.
To probe in greater detail the changes at the ceramometal interface induced by heat energy absorption, using energy diffraction X-ray spectroscopy (EDS) and scanning electron microscopy (SEM) and correlate these changes with the shear bond strength of porcelain to nickel chromium alloy.
Seventy-five strips of nickel-chromium alloy (20 mm long, 5 mm wide, 3 mm thick) were prepared and layered with porcelain, conforming to ANSI/ADA specification no. 38 (for Metal-Ceramic Dental Restorative Systems: 2010). These test specimens were divided equally into three groups. Specimens of each group (25) were fired to a specific temperature range, that is 700°C, 900°C, and 960°C. SEM and EDS were performed on all specimens, at the metal alloy/ceramic interface. Bonding of the ceramic layer to the metal alloy was evaluated by a shear bond strength test as per ANSI/ADA specification no. 38. The data were recorded and analyzed using one-way ANOVA and post hoc Tukey HSD test.
SEM images of the porcelain/metal alloy interface revealed roughness of the metal alloy surface adjacent to the ceramic layer. EDS study revealed that an oxygen depletion zone was formed at the interface region, facilitating the formation of intermetallic compounds. The mean shear bond strength showed an upward trend until 900°C and decreased thereafter.
Formation of intermetallic compounds at the interface, in the presence of an oxygen depletion zone, was the prime factor in bonding of porcelain to metal alloy. This provides a new concept of ceramometal bonding.
使用能量衍射X射线光谱法（EDS）和扫描电子显微镜（SEM）更详细地探究热能吸收引起的烤瓷合金界面变化，并将这些变化与瓷与镍铬合金的剪切粘结强度相关联。
制备75条镍铬合金条（长20mm，宽5mm，厚3mm），并按照ANSI/ADA第38号规范（《金属烤瓷牙修复系统：2010》）进行瓷层堆塑。这些测试样本平均分为三组。每组样本（25个）分别在特定温度范围（即700°C、900°C和960°C）下烧制。对所有样本的金属合金/陶瓷界面进行SEM和EDS检测。按照ANSI/ADA第38号规范，通过剪切粘结强度测试评估陶瓷层与金属合金的粘结情况。使用单因素方差分析和事后Tukey HSD检验记录和分析数据。
烤瓷/金属合金界面的SEM图像显示，靠近陶瓷层的金属合金表面存在粗糙度。EDS研究表明，在界面区域形成了一个氧耗尽区，促进了金属间化合物的形成。平均剪切粘结强度在900°C之前呈上升趋势，此后下降。
在氧耗尽区存在的情况下，界面处金属间化合物的形成是瓷与金属合金粘结的主要因素。这提供了一种新的烤瓷合金粘结概念。
