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基于金属超分子聚合物的三元存储器件的温度响应型记忆行为。

Thermoresponsive Memory Behavior in Metallosupramolecular Polymer-Based Ternary Memory Devices.

机构信息

College of Chemistry, Chemical Engineering, and Materials Science, Collaborative Innovation Center of Suzhou Nano Science and Technology, National Center for International Research, and ‡Institute of Functional Nano & Soft Materials Laboratory and Jiangsu Key Laboratory for Carbon-Based Functional Materials, Soochow University , Suzhou 215123, P. R. China.

出版信息

ACS Appl Mater Interfaces. 2017 Sep 27;9(38):32930-32938. doi: 10.1021/acsami.7b09132. Epub 2017 Sep 12.

DOI:10.1021/acsami.7b09132
PMID:28849649
Abstract

Thermal-sensitive materials, such as metallosupramolecular polymers, have been integrated into devices for a broad range of applications. However, the role of these materials is limited to temperature sensing and the lack of a memory function. Herein, we present novel [PolyCo-L1L2-PF]-based organic resistive memories (ORMs) possessing both a thermal response and ternary memory behavior with three electrical resistance states [high (HRS), intermediate (IRS), and low (LRS)]. Furthermore, the thermal behavior can be memorized by the Al/[PolyCoL1L2-PF]/indium-tin oxide devices. Heating and cooling the devices at a LRS results in a switch from the LRS to a HRS and further to a LRS, indicating that the thermal behavior can be efficiently memorized. Following the heating and cooling process, devices at a HRS retain their ternary memory behavior, while an unstable resistance variation behavior is observed at the IRS. We propose a possible mechanism for the thermoresponsive memory behavior, and this finding provides a guide for the design of future thermoresponsive ORMs.

摘要

热敏材料,如金属超分子聚合物,已被整合到各种应用的设备中。然而,这些材料的作用仅限于温度感应,且缺乏记忆功能。在此,我们提出了一种新型基于[PolyCo-L1L2-PF]的有机电阻式存储器(ORM),它具有热响应和三种电阻状态[高(HRS)、中(IRS)和低(LRS)]的三进制存储行为。此外,Al/[PolyCoL1L2-PF]/氧化铟锡器件可以记忆热行为。在 LRS 下加热和冷却器件会导致从 LRS 切换到 HRS 再切换到 LRS,这表明热行为可以被有效地记忆。在加热和冷却过程之后,处于 HRS 的器件保留其三进制存储行为,而 IRS 则观察到不稳定的电阻变化行为。我们提出了一种热敏存储行为的可能机制,这一发现为设计未来的热敏 ORM 提供了指导。

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