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体相 InAs 中本征缺陷和硅掺杂剂扩散的从头算研究。

Ab Initio Studies of the Diffusion of Intrinsic Defects and Silicon Dopants in Bulk InAs.

机构信息

Robert F. Smith School of Chemical and Biomolecular Engineering and ‡Department of Materials Science and Engineering, Cornell University , Ithaca, New York 14853, United States.

出版信息

Langmuir. 2017 Oct 24;33(42):11484-11489. doi: 10.1021/acs.langmuir.7b02669. Epub 2017 Oct 2.

Abstract

We expose the predominant diffusional pathways for In and As in InAs, as well as dopant Si atoms in InAs, using Nudged Elastic Band calculations in conjunction with accurate Density Functional Theory calculations of the energy of defective systems. Our results show that As is a very fast diffuser compared to In and Si for both vacancy-assisted and interstitially mediated mechanisms. Larger indium atoms, on the other hand, are very slow diffusers and strongly prefer to remain on the In sublattice. Silicon also prefers to stay in substitutional sites in the In sublattice, in agreement with the fact that Si is used to create n-doped InAs. We find that the mechanism by which Si diffuses within the InAs lattice is very unlikely to proceed via vacancy-assisted jumps, since these routes encounter energy barriers above 2 eV. In contrast, silicon can readily make interstitial jumps since they occur with energy barriers as small as 0.23 eV. This suggests that an interstitial diffusion mechanism is strongly preferred for Si diffusion in InAs which challenges the common presumption made for another similar III-V compound, namely GaAs, that Si diffusion takes place via a vacancy-assisted mechanism.

摘要

我们使用 Nudged Elastic Band 计算结合精确的密度泛函理论计算缺陷系统的能量,揭示了 InAs 中 In 和 As 以及掺杂 Si 原子的主要扩散途径。我们的结果表明,对于空位辅助和间隙中介机制,As 的扩散速度都比 In 和 Si 快得多。另一方面,较大的铟原子扩散速度非常慢,并且强烈倾向于留在 In 亚晶格上。硅也更喜欢留在 In 亚晶格中的替代位置,这与 Si 用于创建 n 型掺杂 InAs 的事实是一致的。我们发现,硅在 InAs 晶格内扩散的机制不太可能通过空位辅助跳跃进行,因为这些路径遇到的能量障碍超过 2 eV。相比之下,硅可以很容易地进行间隙跳跃,因为它们的能量障碍只有 0.23 eV 那么小。这表明,对于 Si 在 InAs 中的扩散,间隙扩散机制是强烈首选的,这挑战了另一种类似的 III-V 化合物 GaAs 中常见的假设,即 Si 扩散是通过空位辅助机制进行的。

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