Alakus Sabuncuoglu Fidan, Ersahan Seyda, Erturk Ergul
Department of Orthodontics Center for Dental Sciences, Erzurum Maresal Cakmak Hospital, Turkey.
Department of Endodontics, Faculty of Dentistry, Bezmialem Vakif University, Turkey.
J Istanb Univ Fac Dent. 2016 Apr 1;50(2):24-30. doi: 10.17096/jiufd.39114. eCollection 2016.
The objective of the present study is to evaluate the effects of Er:YAG laser debonding of ceramic brackets on the bond strength and the amount of adhesive resin remnant.
Twenty human mandibular incisors were randomly divided into two groups of 10 and polycrystalline ceramic brackets (Transcend series 6000, 3M Unitek, Monrovia, CA, USA) were bonded on enamel surfaces. Group 1 was the control group in which no laser application was performed prior to the shear bond strength (SBS) testing. In Group 2, Er:YAG was applied in 3W power for 6 seconds using the scanning method. The brackets were tested for SBS with an Instron universal testing machine and results were expressed in megapascals (MPa). The amount of adhesive remnant was evaluated with Adhesive Remnant Index (ARI). One-way analysis of variance and Tukey's post-hoc tests were used for statistical analysis.
Mean ± standard deviation of SBS values in the control group was 13.42 ±1.23 MPa and 8.47 ±0.71 MPa in the Er:YAG group and this difference was statistically significant (p<0.05). The evaluation of ARI scores demonstrated more adhesive was left on the enamel surface with Er:YAG group.
3W power Er:YAG laser application with the scanning method to polycrystalline ceramic brackets demonstrated lower bond strengths and higher ARI scores during the debonding procedure.
本研究的目的是评估铒激光去除陶瓷托槽对粘结强度和粘结树脂残留量的影响。
将20颗人下颌切牙随机分为两组,每组10颗,在牙釉质表面粘结多晶陶瓷托槽(Transcend系列6000,3M Unitek,美国加利福尼亚州蒙罗维亚)。第1组为对照组,在进行剪切粘结强度(SBS)测试前未进行激光照射。第2组使用扫描方法,以3W功率的铒激光照射6秒。使用Instron万能试验机对托槽进行SBS测试,结果以兆帕(MPa)表示。用粘结残留指数(ARI)评估粘结剂残留量。采用单因素方差分析和Tukey事后检验进行统计分析。
对照组SBS值的平均值±标准差为13.42±1.23MPa,铒激光组为8.47±0.71MPa,差异具有统计学意义(p<0.05)。ARI评分评估表明,铒激光组在牙釉质表面残留的粘结剂更多。
采用扫描方法对多晶陶瓷托槽应用3W功率的铒激光,在去除托槽过程中显示出较低的粘结强度和较高的ARI评分。