Department of Materials Science and Engineering and ‡Applied Science Research Institute, Korea Advanced Institute of Science and Technology (KAIST) , 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
ACS Appl Mater Interfaces. 2017 Nov 15;9(45):39650-39656. doi: 10.1021/acsami.7b08626. Epub 2017 Nov 3.
Metal nanowires have been considered as essential components for flexible transparent conducting electrodes (TCEs) with high transparency and low sheet resistance. However, large surface roughness and high interwire junction resistance limit the practical use of metal wires as TCEs. Here, we report Cu microbelt network (Cu MBN) with coalescence junction and low surface roughness for next-generation flexible TCEs. In particular, the unique embedded structure of Cu MBN in colorless polyimide (cPI) film was achieved to reduce the surface roughness as well as enhance mechanical stability. The TCEs using junction-free Cu MBN embedded in cPI exhibited excellent mechanical stability up to 100 000 bending cycles, high transparency of 95.18%, and a low sheet resistance of 6.25 Ω sq. Highly robust Cu MBN-embedded cPI-based TCE showed outstanding flexible heater performance, i.e., high saturation temperature (120 °C) at very low voltage (2.3 V), owing to the high thermal stability of cPI and excellent thermal conductivity of the Cu MBN.
金属纳米线被认为是具有高透明度和低方阻的柔性透明导电电极（TCE）的重要组成部分。然而，大的表面粗糙度和高的线间结电阻限制了金属线作为 TCE 的实际应用。在这里，我们报告了具有融合结和低表面粗糙度的 Cu 微带网络（Cu MBN），用于下一代柔性 TCE。特别是，通过在无色聚酰亚胺（cPI）薄膜中实现独特的嵌入结构，降低了表面粗糙度并提高了机械稳定性。使用嵌入 cPI 中的无结 Cu MBN 的 TCE 表现出优异的机械稳定性，可承受多达 100000 次弯曲循环，透明度高达 95.18%，方阻低至 6.25 Ω/sq。高度坚固的嵌入 Cu MBN 的 cPI 基 TCE 表现出出色的柔性加热器性能，即非常低的电压（2.3 V）下就能达到高饱和温度（120°C），这归因于 cPI 的高热稳定性和 Cu MBN 的优异导热性。
