[Comparative analysis of some mechanical properties of solder joints with a copper-aluminum alloy, using two types of low-fusing solder].
作者信息
Gomes A A, Vieira L F, Pegoraro L F, Salvador M C, Netto J C, Gomes A M
出版信息
Rev Odontol Univ Sao Paulo. 1987 Jul-Sep;1(3):3-9.
PMID:2907388
Abstract
摘要
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