Faculty of Science, University of Ontario Institute of Technology , 2000 Simcoe Street North, Oshawa, Ontario L1H 7K4, Canada.
ACS Appl Mater Interfaces. 2017 Nov 22;9(46):40438-40445. doi: 10.1021/acsami.7b11848. Epub 2017 Nov 7.
Novel electrochromic (EC) materials were developed and formed by a two-step chemical deposition process. First, a self-assembled monolayer (SAM) of 2,2':6',2″-terpyridin-4'-ylphosphonic acid, L, was deposited on the surface of a nanostructured conductive indium-tin oxide (ITO) screen-printed support by simple submerging of the support into an aqueous solution of L. Further reaction of the SAM with Fe or Ru ions results in the formation of a monolayer of the redox-active metal complex covalently bound to the ITO support (Fe-L/ITO and Ru-L/ITO, respectively). These novel light-reflective EC materials demonstrate a high color difference, significant durability, and fast switching speed. The Fe-based material shows an excellent change of optical density and coloration efficiency. The results of thermogravimetric analysis suggest high thermal stability of the materials. Indeed, the EC characteristics do not change significantly after heating of Fe-L/ITO at 100 °C for 1 week, confirming the excellent stability and high EC reversibility. The proposed fabrication approach that utilizes interparticle porosity of the support and requires as low as a monolayer of EC active molecule benefits from the significant molecular economy when compared with traditional polymer-based EC devices and is significantly less time-consuming than layer-by-layer growth of coordination-based molecular assemblies.
新型电致变色(EC)材料通过两步化学沉积工艺开发和形成。首先,通过将支持物简单地浸入 L 的水溶液中,将 2,2':6',2″-三联吡啶-4'-基磷酸,L 的自组装单层(SAM)沉积在纳米结构的导电氧化铟锡(ITO)丝网印刷支撑物的表面上。SAM 与 Fe 或 Ru 离子的进一步反应导致氧化还原活性金属配合物的单层共价键合到 ITO 支撑物上(分别为 Fe-L/ITO 和 Ru-L/ITO)。这些新型反光 EC 材料表现出高的颜色差异、显著的耐久性和快速的开关速度。基于 Fe 的材料表现出出色的光密度变化和着色效率。热重分析的结果表明材料具有高的热稳定性。实际上,Fe-L/ITO 在 100°C 加热 1 周后,EC 特性没有明显变化,证实了其优异的稳定性和高 EC 可逆性。所提出的制造方法利用支撑物的颗粒间孔隙度,并且需要低至单层 EC 活性分子,与传统的基于聚合物的 EC 器件相比,具有显著的分子经济性,并且比基于配位的分子组装的逐层生长耗时少得多。