Department of Mechanical Engineering, University of Hong Kong , Pokfulam, Hong Kong.
ACS Appl Mater Interfaces. 2017 Dec 27;9(51):44617-44624. doi: 10.1021/acsami.7b14711. Epub 2017 Dec 18.
In this paper, we report high-performance monolayer thin-film transistors (TFTs) based on a variety of two-dimensional layered semiconductors such as MoS, WS, and MoSe which were obtained from their corresponding bulk counterparts via an anomalous but high-yield and low-cost electrochemical corrosion process, also referred to as electro-ablation (EA), at room temperature. These monolayer TFTs demonstrated current ON-OFF ratios in excess of 10 along with ON currents of 120 μA/μm for MoS, 40 μA/μm for WS, and 40 μA/μm for MoSe which clearly outperform the existing TFT technologies. We found that these monolayers have larger Schottky barriers for electron injection compared to their multilayer counterparts, which is partially compensated by their superior electrostatics and ultra-thin tunnel barriers. We observed an Anderson type semiconductor-to-metal transition in these monolayers and also discussed possible scattering mechanisms that manifest in the temperature dependence of the electron mobility. Finally, our study suggests superior chemical stability and electronic integrity of monolayers even after being exposed to extreme electro-oxidation and corrosion processes which is promising for the implementation of such TFTs in harsh environment sensing. Overall, the EA process proves to be a facile synthesis route offering higher monolayer yields than mechanical exfoliation and lower cost and complexity than chemical vapor deposition methods.
本文报道了通过室温下异常高产且低成本的电化学腐蚀工艺(也称为电烧蚀),从块状对应物中获得的各种二维层状半导体(如 MoS、WS 和 MoSe)的高性能单层薄膜晶体管(TFT)。这些单层 TFT 的电流开关比超过 10,MoS 的导通电流为 120μA/μm,WS 的导通电流为 40μA/μm,MoSe 的导通电流为 40μA/μm,明显优于现有的 TFT 技术。我们发现,与多层相比,这些单层的电子注入肖特基势垒更大,但其优越的静电和超薄隧道势垒部分得到补偿。我们观察到这些单层中的安德森型半导体-金属转变,并讨论了在电子迁移率的温度依赖性中表现出的可能散射机制。最后,我们的研究表明,即使在经历极端电氧化和腐蚀过程后,单层仍具有优异的化学稳定性和电子完整性,这对于在恶劣环境感应中实施此类 TFT 具有广阔的应用前景。总的来说,电烧蚀工艺是一种简便的合成途径,与机械剥落相比,其单层产量更高,与化学气相沉积方法相比,成本和复杂性更低。