透射扫描电子显微镜：缺陷观察与图像模拟
Transmission scanning electron microscopy: Defect observations and image simulations.
作者信息
Callahan Patrick G, Stinville Jean-Charles, Yao Eric R, Echlin McLean P, Titus Michael S, De Graef Marc, Gianola Daniel S, Pollock Tresa M
机构信息
Materials Department, University of California Santa Barbara, Santa Barbara, CA 93106, USA.
Materials Department, University of California Santa Barbara, Santa Barbara, CA 93106, USA; School of Materials Engineering, Purdue University, West Lafayette, IN 47907, USA.
出版信息
Ultramicroscopy. 2018 Mar;186:49-61. doi: 10.1016/j.ultramic.2017.11.004. Epub 2017 Dec 6.
The new capabilities of a FEG scanning electron microscope (SEM) equipped with a scanning transmission electron microscopy (STEM) detector for defect characterization have been studied in parallel with transmission electron microscopy (TEM) imaging. Stacking faults and dislocations have been characterized in strontium titanate, a polycrystalline nickel-base superalloy and a single crystal cobalt-base material. Imaging modes that are similar to conventional TEM (CTEM) bright field (BF) and dark field (DF) and STEM are explored, and some of the differences due to the different accelerating voltages highlighted. Defect images have been simulated for the transmission scanning electron microscopy (TSEM) configuration using a scattering matrix formulation, and diffraction contrast in the SEM is discussed in comparison to TEM. Interference effects associated with conventional TEM, such as thickness fringes and bending contours are significantly reduced in TSEM by using a convergent probe, similar to a STEM imaging modality, enabling individual defects to be imaged clearly even in high dislocation density regions. Beyond this, TSEM provides significant advantages for high throughput and dynamic in-situ characterization.
配备扫描透射电子显微镜（STEM）探测器用于缺陷表征的场发射枪扫描电子显微镜（SEM）的新功能已与透射电子显微镜（TEM）成像并行研究。在钛酸锶、多晶镍基高温合金和单晶钴基材料中对堆垛层错和位错进行了表征。探索了与传统TEM（CTEM）明场（BF）和暗场（DF）以及STEM相似的成像模式，并强调了由于加速电压不同而产生的一些差异。使用散射矩阵公式对透射扫描电子显微镜（TSEM）配置的缺陷图像进行了模拟，并与TEM相比讨论了SEM中的衍射衬度。通过使用会聚探针，类似于STEM成像模式，与传统TEM相关的干涉效应，如厚度条纹和弯曲轮廓，在TSEM中显著降低，即使在高位错密度区域也能清晰地对单个缺陷进行成像。除此之外，TSEM在高通量和动态原位表征方面具有显著优势。
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