Li Junye, Meng Wenqing, Dong Kun, Zhang Xinming, Zhao Weihong
College of Mechanical and Electric Engineering, Changchun University of Science and Technology, Changchun, 130022, China.
Nanoscale Res Lett. 2018 Jan 11;13(1):11. doi: 10.1186/s11671-017-2412-2.
Abrasive flow polishing plays an important part in modern ultra-precision machining. Ultrafine particles suspended in the medium of abrasive flow removes the material in nanoscale. In this paper, three-dimensional molecular dynamics (MD) simulations are performed to investigate the effect of impacting direction on abrasive cutting process during abrasive flow polishing. The molecular dynamics simulation software Lammps was used to simulate the cutting of single crystal copper with SiC abrasive grains at different cutting angles (0-45). At a constant friction coefficient, we found a direct relation between cutting angle and cutting force, which ultimately increases the number of dislocation during abrasive flow machining. Our theoretical study reveal that a small cutting angle is beneficial for improving surface quality and reducing internal defects in the workpiece. However, there is no obvious relationship between cutting angle and friction coefficient.
磨料流抛光在现代超精密加工中起着重要作用。悬浮在磨料流介质中的超细颗粒以纳米级去除材料。本文进行了三维分子动力学（MD）模拟，以研究冲击方向对磨料流抛光过程中磨料切削过程的影响。使用分子动力学模拟软件Lammps来模拟在不同切削角度（0 - 45度）下用SiC磨粒切削单晶铜的过程。在摩擦系数恒定的情况下，我们发现切削角度与切削力之间存在直接关系，这最终增加了磨料流加工过程中的位错数量。我们的理论研究表明，小切削角度有利于提高表面质量并减少工件内部缺陷。然而，切削角度与摩擦系数之间没有明显关系。
