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氧化物半导体的温度依赖性与薄膜晶体管的沟道效应

Temperature Dependence of Oxide Semiconductor and Channel Effect of Thin Film Transistor.

作者信息

Oh Teresa

机构信息

Department of Semiconductor Engineering, Cheongju University, 298 Daesungro Chungwonku, Cheongju, 28503, Korea.

出版信息

J Nanosci Nanotechnol. 2018 Mar 1;18(3):1833-1836. doi: 10.1166/jnn.2018.14962.

DOI:10.1166/jnn.2018.14962
PMID:29448667
Abstract

ZTO was prepared on SiOC/ITO glass and the electrical characteristics were analyzed in accordance with the annealing temperature to research the temperature dependence and an amorphous structure. SiOC annealed at 150 °C as a gate insulator became an amorphous structure. The ZTO annealed at 150 °C had the capacitance without any variation. However, the capacitance of ZTO on SiOC annealed at 150 °C was increased due to the reduction of energy loss. ZTO/SiOC transistor was observed the ambipolar transfer characteristics with high stability and mobility in accordance with the decrement of drain voltages as a result of tunneling effect. Therefore it was obtained that the SiOC annealed at 150 °C means the highest Schottky barrier (SB) at the interface of ZTO/SiOC as the optimization parameter.

摘要

ZTO制备在SiOC/ITO玻璃上,并根据退火温度分析其电学特性,以研究温度依赖性和非晶结构。在150°C退火的SiOC作为栅极绝缘体形成了非晶结构。在150°C退火的ZTO具有恒定的电容。然而,由于能量损失的减少,在150°C退火的SiOC上的ZTO电容增加。由于隧穿效应,随着漏极电压的降低,观察到ZTO/SiOC晶体管具有高稳定性和迁移率的双极传输特性。因此,得出在150°C退火的SiOC作为优化参数意味着ZTO/SiOC界面处的肖特基势垒(SB)最高。

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