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激光切割微切片术在硬组织共聚焦显微镜中的评估。

Evaluation of laser ablation microtomy for correlative microscopy of hard tissues.

机构信息

Dental Physical Sciences, Queen Mary University of London, London, UK.

出版信息

J Microsc. 2018 Jul;271(1):17-30. doi: 10.1111/jmi.12689. Epub 2018 Feb 27.

Abstract

Laser ablation machining or microtomy (LAM) is a relatively new approach to producing slide mounted sections of translucent materials. We evaluated the method with a variety of problems from the bone, joint and dental tissues fields where we require thin undecalcified and undistorted sections for correlative light microscopy (LM) and backscattered electron scanning electron microscopy (BSE SEM). All samples were embedded in poly-methylmethacrlate (PMMA) and flat block surfaces had been previously studied by BSE-SEM and confocal scanning light microscopy (CSLM). Most were also studied by X-yay microtomography (XMT). The block surface is stuck to a glass slide with cyanoacrylate adhesive. Setting the section thickness and levelling uses inbuilt optical coherence tomographic imaging. Tight focusing of near-infrared laser radiation in the sectioning plane gives extreme intensities causing photodisruption of material at the focal point. The laser beam is moved by a fast scanner to write a cutting line, which is simultaneously moved by an XY positioning unit to create a sectioning plane. The block is thereby released from the slide, leaving the section stuck to the slide. Light, wet polishing on the finest grade (4000 grit) silicon carbide polishing paper is used to remove a 1-2 μm thick damaged layer at the surface of the section. Sections produced by laser cutting are fine in quality and superior to those produced by mechanical cutting and can be thinner than the 'voxel' in most laboratory X-ray microtomography systems. The present extensive pilot studies have shown that it works to produce samples which we can study by both light and electron microscopy.

摘要

激光烧蚀加工或微切片(LAM)是一种相对较新的方法,用于制作半透明材料的载玻片切片。我们使用各种来自骨骼、关节和牙齿组织领域的问题评估了这种方法,在这些领域,我们需要用于相关光显微镜(LM)和背散射电子扫描电子显微镜(BSE-SEM)的薄未脱钙和未变形的切片。所有样本均嵌入聚甲基丙烯酸甲酯(PMMA)中,并且已经通过 BSE-SEM 和共聚焦扫描光显微镜(CSLM)研究了平面块表面。大多数还通过 X-yay 微断层扫描(XMT)进行了研究。将块表面用氰基丙烯酸酯粘合剂粘在载玻片上。使用内置的光学相干断层成像来设置切片厚度和平整度。在切片平面中紧密聚焦近红外激光辐射会产生极高的强度,从而在焦点处使材料发生光致破坏。激光束由快速扫描仪移动,以写入切割线,同时通过 XY 定位单元移动以创建切片平面。块从载玻片上释放,留下粘在载玻片上的切片。在最细的等级(4000 目)碳化硅抛光纸上进行湿光抛光,以去除切片表面 1-2μm 厚的损坏层。激光切割产生的切片质量很好,优于机械切割产生的切片,并且可以比大多数实验室 X 射线微断层扫描系统中的“体素”更薄。目前的广泛试点研究表明,它可以用于制作我们可以通过光镜和电子显微镜研究的样本。

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