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电沉积 Ni 基磁性介孔薄膜作为原子层沉积的智能表面:一种“全化学”沉积方法制备 3D 纳米工程复合层。

Electrodeposited Ni-Based Magnetic Mesoporous Films as Smart Surfaces for Atomic Layer Deposition: An "All-Chemical" Deposition Approach toward 3D Nanoengineered Composite Layers.

机构信息

Departament de Física, Facultat de Ciències , Universitat Autònoma de Barcelona , E-08193 Bellaterra , Barcelona , Spain.

State Key laboratory of Solidification Processing, Center of Advanced Lubrication and Seal Materials , Northwestern Polytechnical University , Xi'an , Shaanxi 710072 , P. R. China.

出版信息

ACS Appl Mater Interfaces. 2018 May 2;10(17):14877-14885. doi: 10.1021/acsami.8b01626. Epub 2018 Apr 17.

Abstract

Mesoporous Ni and Cu-Ni (CuNi and CuNi in at. %) films, showing a three-dimensional (3D) porous structure and tunable magnetic properties, are prepared by electrodeposition from aqueous surfactant solutions using micelles of P-123 triblock copolymer as structure-directing entities. Pores between 5 and 30 nm and dissimilar space arrangements (continuous interconnected networks, circular pores, corrugated mesophases) are obtained depending on the synthetic conditions. X-ray diffraction studies reveal that the Cu-Ni films have crystallized in the face-centered cubic structure, are textured, and exhibit certain degree of phase separation, particularly those with a higher Cu content. Atomic layer deposition (ALD) is used to conformally coat the mesopores of CuNi film with amorphous AlO, rendering multiphase "nano-in-meso" metal-ceramic composites without compromising the ferromagnetic response of the metallic scaffold. From a technological viewpoint, these 3D nanoengineered composite films could be appealing for applications like magnetically actuated micro/nanoelectromechanical systems (MEMS/NEMS), voltage-driven magneto-electric devices, capacitors, or as protective coatings with superior strength and tribological performance.

摘要

介孔 Ni 和 Cu-Ni(原子百分比分别为 CuNi 和 CuNi)薄膜通过在水相表面活性剂溶液中电沉积,利用 P-123 三嵌段共聚物胶束作为结构导向剂来制备,具有三维(3D)多孔结构和可调磁性能。根据合成条件,可获得 5nm 至 30nm 之间的孔和不同的空间排列(连续相互连接的网络、圆形孔、波纹状中间相)。X 射线衍射研究表明,Cu-Ni 薄膜在面心立方结构中结晶,具有织构,并表现出一定程度的相分离,特别是那些具有较高 Cu 含量的薄膜。原子层沉积(ALD)用于将 CuNi 薄膜的介孔用非晶态 AlO 进行共形涂覆,形成多相“纳米嵌入介孔”金属-陶瓷复合材料,而不会影响金属支架的铁磁响应。从技术角度来看,这些 3D 纳米工程复合薄膜可能适用于磁驱动微/纳机电系统(MEMS/NEMS)、电压驱动的磁电设备、电容器,或作为具有优异强度和摩擦学性能的防护涂层。

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