Chen Pingan, Zhang Jian, Shen Qiang, Luo Guoqiang, Dai Yang, Wang Chuanbing, Li Meijuan, Zhang Lianmeng
J Nanosci Nanotechnol. 2017 Apr;17(4):2447-452. doi: 10.1166/jnn.2017.12637.
Microstructure and thermal conductivity (TC) of carbon nanotubes reinforced Cu (CNT-Cu) composites have been studied. When CNTs were coated with nano Cu by electroless plating, the TC of CNT-Cu composites showed a noticeable improvement and increased with CNT contents. When 1.0 vol% CNTs was added, the TC of CNT-Cu composites increased to 420.4 W/(m · K), 30% higher than that of monolithic Cu (323.1 W/(m · K)). According to the measured TC of CNT-Cu composites, the interfacial thermal resistance of CNT-Cu composites was calculated as 3.0 × 10⁻⁹ m² K/W which was lower than the reported values of CNTs reinforced polymer matrix composites and ceramic matrix composites. Microstructures showed that CNTs modified with nano Cu were homogeneously dispersed and embedded in the Cu matrix, indicating that there was strong bonding between CNTs and Cu. The homogeneously dispersed CNTs and reduction of interfacial thermal resistance resulted in the improvement of thermal conductivity of CNT-Cu composites. Therefore, the prepared CNT-Cu composites are promising materials for thermal management applications.
对碳纳米管增强铜（CNT-Cu）复合材料的微观结构和热导率（TC）进行了研究。当通过化学镀在碳纳米管上包覆纳米铜时，CNT-Cu复合材料的热导率有显著提高，并随碳纳米管含量的增加而升高。当添加1.0体积%的碳纳米管时，CNT-Cu复合材料的热导率提高到420.4W/（m·K），比纯铜（323.1W/（m·K））高30%。根据测得的CNT-Cu复合材料的热导率，计算出CNT-Cu复合材料的界面热阻为3.0×10⁻⁹m²K/W，低于报道的碳纳米管增强聚合物基复合材料和陶瓷基复合材料的界面热阻。微观结构表明，用纳米铜改性的碳纳米管均匀分散并嵌入铜基体中，表明碳纳米管与铜之间存在强结合。碳纳米管的均匀分散和界面热阻的降低导致了CNT-Cu复合材料热导率的提高。因此，制备的CNT-Cu复合材料是热管理应用的有前途的材料。
