Matthews Mike B, Kearns Stuart L, Buse Ben
1AWE,Aldermaston, Reading RG7 4PR,UK.
2University of Bristol, School of Earth Sciences,Wills Memorial Building, Queens Road, Clifton BS8 1RJ,UK.
Microsc Microanal. 2018 Apr;24(2):83-92. doi: 10.1017/S1431927618000193.
The accuracy to which Cu and Al coatings can be determined, and the effect this has on the quantification of the substrate, is investigated. Cu and Al coatings of nominally 5, 10, 15, and 20 nm were sputter coated onto polished Bi using two configurations of coater: One with the film thickness monitor (FTM) sensor colocated with the samples, and one where the sensor is located to one side. The FTM thicknesses are compared against those calculated from measured Cu Lα and Al Kα k-ratios using PENEPMA, GMRFilm, and DTSA-II. Selected samples were also cross-sectioned using focused ion beam. Both systems produced repeatable coatings, the thickest coating being approximately four times the thinnest coating. The side-located FTM sensor indicated thicknesses less than half those of the software modeled results, propagating on to 70% errors in substrate quantification at 5 kV. The colocated FTM sensor produced errors in film thickness and substrate quantification of 10-20%. Over the range of film thicknesses and accelerating voltages modeled both the substrate and coating k-ratios can be approximated by linear trends as functions of film thickness. The Al films were found to have a reduced density of ~2 g/cm2.
研究了测定铜和铝涂层的准确度及其对基底定量分析的影响。使用两种镀膜机配置，将标称厚度为5、10、15和20纳米的铜和铝涂层溅射镀在抛光的铋上：一种是膜厚监测器（FTM）传感器与样品并置，另一种是传感器位于一侧。将FTM测量的厚度与使用PENEPMA、GMRFilm和DTSA-II根据测量的铜Lα和铝Kα k比率计算得到的厚度进行比较。还使用聚焦离子束对选定的样品进行了横截面分析。两种系统都能产生可重复的涂层，最厚的涂层约为最薄涂层的四倍。位于一侧的FTM传感器显示的厚度不到软件模拟结果的一半，在5 kV时基底定量分析的误差高达70%。并置的FTM传感器在膜厚和基底定量分析中产生了10%至20%的误差。在所模拟的膜厚和加速电压范围内，基底和涂层的k比率都可以用膜厚的线性趋势近似表示。发现铝膜的密度降低了约2 g/cm³ 。
