Opt Lett. 2018 Oct 15;43(20):4883-4886. doi: 10.1364/OL.43.004883.
Hybrid integration of a III-V microdisk resonator on a silicon-on-insulator waveguide platform is demonstrated. Transfer printing with nanoscale accuracy is used to micro-assemble an evanescently coupled all-pass microdisk resonator with a targeted coupler gap of 100 nm using pre-fabricated AlGaAs and silicon components. Transmission measurements show hybrid resonances with a loaded Q-factor of 7×10 and a cavity finesse of over 100.
在绝缘体上硅波导平台上实现了 III-V 微盘谐振器的混合集成。采用纳米级精度的转印技术,使用预制的 AlGaAs 和硅组件,微组装出具有 100nm 目标耦合间隙的消逝场全通微盘谐振器。传输测量显示,混合谐振器的加载 Q 因子为 7×10,腔精细度超过 100。