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用于透明柔性薄膜晶体管应用的掺铝氧化锡薄膜的电学、结构、光学和粘附特性

Electrical, Structural, Optical, and Adhesive Characteristics of Aluminum-Doped Tin Oxide Thin Films for Transparent Flexible Thin-Film Transistor Applications.

作者信息

Lee Seung-Hun, Kwon Kihwan, Kim Kwanoh, Yoon Jae Sung, Choi Doo-Sun, Yoo Yeongeun, Kim Chunjoong, Kang Shinill, Kim Jeong Hwan

机构信息

Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM), Daejeon 34103, Korea.

Department of Materials Science and Engineering, Chungnam National University, Daejeon 34134, Korea.

出版信息

Materials (Basel). 2019 Jan 3;12(1):137. doi: 10.3390/ma12010137.

Abstract

The properties of Al-doped SnO films deposited via reactive co-sputtering were examined in terms of their potential applications for the fabrication of transparent and flexible electronic devices. Al 2.2-atom %-doped SnO thin-film transistors (TFTs) exhibit improved semiconductor characteristics compared to non-doped films, with a lower sub-threshold swing of ~0.68 Vdec, increased on/off current ratio of ~8 × 10⁷, threshold voltage (V) near 0 V, and markedly reduced (by 81%) V instability in air, attributable to the decrease in oxygen vacancy defects induced by the strong oxidizing potential of Al. Al-doped SnO films maintain amorphous crystallinity, an optical transmittance of ~97%, and an adhesive strength (to a plastic substrate) of over 0.7 kgf/mm; such films are thus promising semiconductor candidates for fabrication of transparent flexible TFTs.

摘要

通过反应性共溅射沉积的铝掺杂氧化锡薄膜的性能,根据其在制造透明和柔性电子器件方面的潜在应用进行了研究。与未掺杂的薄膜相比,2.2原子百分比铝掺杂的氧化锡薄膜晶体管(TFT)表现出改善的半导体特性,亚阈值摆幅约为0.68 V/dec,开/关电流比增加约8×10⁷,阈值电压(V)接近0 V,并且在空气中V不稳定性显著降低(降低81%),这归因于铝的强氧化电位导致的氧空位缺陷减少。铝掺杂氧化锡薄膜保持非晶态结晶度、约97%的光学透过率以及(对塑料基板的)超过0.7 kgf/mm的粘合强度;因此,此类薄膜是制造透明柔性TFT的有前景的半导体候选材料。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/61ed/6337128/00db92c482ff/materials-12-00137-g001.jpg

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