Shahbazi Amir Hossein, Koohian Ata, Madanipour Khosro, Azadeh Mohammad
Appl Opt. 2018 Dec 1;57(34):9988-9996. doi: 10.1364/AO.57.009988.
In this paper, the scribing of the metal thin film using a continuous-wave laser is investigated theoretically and experimentally. We propose a reversible relation between incident fluence and ablation width. Microscopic analysis of the results is compared to theoretical expectations. Scribing has been done by focusing a 450 nm laser diode beam on 100 nm chromium thin film. Beam power and scanning speed are varied in the domains of 0.02-1.0 W and 0.05-5 mm/s, respectively. The microscopic images of the thin film show that the average ablation width on metal thin film varies slightly by increasing the scanning speed, which was anticipated by theory. Moreover if scanning speed increases, the ablation quality is reduced significantly and is not compensated by increasing incident power. According to microscopic images of the sample, this method could be a good substitute for pulsed-laser scribing in many applications such as making solar cells.
本文对使用连续波激光划刻金属薄膜进行了理论和实验研究。我们提出了入射能量密度与烧蚀宽度之间的可逆关系。将结果的微观分析与理论预期进行了比较。通过将450纳米激光二极管光束聚焦在100纳米厚的铬薄膜上来进行划刻。光束功率和扫描速度分别在0.02 - 1.0瓦和0.05 - 5毫米/秒的范围内变化。薄膜的微观图像表明，金属薄膜上的平均烧蚀宽度随扫描速度的增加而略有变化，这与理论预期相符。此外，如果扫描速度增加，烧蚀质量会显著降低，且无法通过增加入射功率来弥补。根据样品的微观图像，该方法在许多应用（如制造太阳能电池）中可以很好地替代脉冲激光划刻。
