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控制加热下的面包面团与固体表面的黏附:面团流变性和界面特性之间的平衡。

Adhesion of Bread Dough to Solid Surfaces Under Controlled Heating: Balance Between the Rheological and Interfacial Properties of Dough.

机构信息

Authors Huault, Vésinet, Giampaoli, and Bosc are with the Ingénierie Produits Aliments, AgroParisTech, Inra, Univ. Paris-Saclay, 1 avenue des Olympiades, 91300, Massy, France.

Author Brogly, Bistac are with the Lab. de Photochimie et d'Ingénierie Macromoléculaires, Univ. de Haute Alsace, 3b rue Alfred Werner, 68093, Mulhouse Cedex, France.

出版信息

J Food Sci. 2019 Mar;84(3):499-506. doi: 10.1111/1750-3841.14462. Epub 2019 Jan 31.

DOI:10.1111/1750-3841.14462
PMID:30706468
Abstract

The adhesion of wheat dough affects many aspects of industrial baking, from kneading raw dough to the final baking process. In this work, an original method was developed to study the effect of temperature on the adhesive properties of bread dough in contact with a solid surface during heating. Using this approach, it will be possible to understand the factors that affect adhesion between dough and a baking surface, which will aid in developing methods to prevent dough from sticking. Overall, the dough's adhesion to a hydrophobic surface globally decreased with an increase in temperature from 35 to 97 °C, with the exception of the temperature range between 55 and 70 °C, in which the energy of adhesion increased slightly. Under these circumstances, the evolution of adhesion was primarily shaped by the rheological properties of the dough. However, when we used a solid surface with different surface energy, the results changed significantly, which suggests that the mechanisms of adhesion during heating are governed by a balance between the interfacial and bulk properties of the heated dough. The overall decrease in the adhesion of the dough to the hydrophobic glass surface may be explained by a decrease in dough hydrophobicity due to structural and chemical changes in the dough.

摘要

面团的粘性会影响工业烘焙的许多方面,从揉制生面团到最终烘焙过程。在这项工作中,开发了一种原始方法来研究在加热过程中面包面团与固体表面接触时温度对面团粘性的影响。使用这种方法,可以了解影响面团与烘焙表面之间粘性的因素,这将有助于开发防止面团粘住的方法。总的来说,面团对疏水表面的整体粘性随着温度从 35°C 增加到 97°C 而逐渐降低,除了 55°C 至 70°C 的温度范围内,粘性略有增加。在这些情况下,粘性的演变主要由面团的流变性质决定。然而,当我们使用具有不同表面能的固体表面时,结果发生了显著变化,这表明加热过程中的粘性机制受加热面团的界面和整体性质之间的平衡控制。面团对疏水性玻璃表面的粘性整体下降可能是由于面团的疏水性降低,这是由于面团的结构和化学变化所致。

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