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用于电容器储能应用的BaTiO₃/聚合物/铝薄膜中BaTiO₃填料粒径对其制备及介电性能的影响

Effects of the Particle Size of BaTiO₃ Fillers on Fabrication and Dielectric Properties of BaTiO₃/Polymer/Al Films for Capacitor Energy-Storage Application.

作者信息

Gu Lulu, Li Tao, Xu Yongjun, Sun Chenghua, Yang Zhenyu, Zhu Deliang, Chen Deliang

机构信息

College of Materials Science and Engineering, Shenzhen University, Shenzhen 518060, China.

School of Materials Science and Engineering & School of Chemical Engineering and Energy Technology, Dongguan University of Technology, Dongguan 523808, China.

出版信息

Materials (Basel). 2019 Jan 31;12(3):439. doi: 10.3390/ma12030439.

Abstract

BaTiO₃/polymer/Al (BPA) composite films for energy storage were fabricated by way of a roll coating and thermal curing process. The coating slurry consisted of silicon-containing heat-resistant resin (CYN-01) and BaTiO₃ particles with various particle sizes obtained from commercial BaTiO₃ powders processed at different durations of wet sand grinding in the presence of silane coupling agent (KH550), which not only improves the dielectric performance of the BPA films but also facilitates its production in a large scale. The major influence factors, such as the ratio between BaTiO₃ and resin and the size of BaTiO₃ particles, were investigated and their related mechanisms were discussed. The results show that modifying BaTiO₃ particles ( = 0.83 μm) with the silane coupling agent of KH550 enhances the dielectric properties of the BPA films. The typical BPA films obtained exhibit a high dielectric constant of 32, a high break strength of 20.8 V/μm and a low dielectric loss of 0.014. The present work provides a simple and convenient way to prepare high-quality ceramic/polymer composite films for energy-storage application in a large scale.

摘要

通过辊涂和热固化工艺制备了用于能量存储的钛酸钡/聚合物/铝(BPA)复合薄膜。涂料浆料由含硅耐热树脂(CYN-01)和不同粒径的钛酸钡颗粒组成,这些颗粒由商业钛酸钡粉末在硅烷偶联剂(KH550)存在下经过不同时长的湿砂研磨制得,这不仅提高了BPA薄膜的介电性能,还便于其大规模生产。研究了诸如钛酸钡与树脂的比例以及钛酸钡颗粒尺寸等主要影响因素,并讨论了其相关机理。结果表明,用KH550硅烷偶联剂改性钛酸钡颗粒(粒径 = 0.83μm)可提高BPA薄膜的介电性能。所制备的典型BPA薄膜具有32的高介电常数、20.8V/μm的高击穿强度和0.014的低介电损耗。本工作提供了一种简单便捷的方法来大规模制备用于能量存储应用的高质量陶瓷/聚合物复合薄膜。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/dbbd/6384974/583d07ed78fc/materials-12-00439-g001.jpg

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