Department of Food Nanotechnology, Research Institute of Food Science and Technology, Mashhad, Iran.
Department of Food Processing, Research Institute of Food Science and Technology (RIFST), P.O. Box 91735-147, Mashhad, Iran.
Int J Biol Macromol. 2019 Jun 15;131:60-66. doi: 10.1016/j.ijbiomac.2019.03.066. Epub 2019 Mar 11.
Encapsulation of vanillin through β-cyclodexterin inclusion complex coacervates (β-CD-IC) was developed to achieve higher thermal stability and controlled release of vanillin. The effect of protein to polysaccharide (Pr:Ps) ratio and core (Vanillin/β-CD-IC) to wall (coacervate) ratio on the vanillin encapsulation as well as thermal, microstructural and physical characteristics of microcapsules were investigated. Microcapsules had particle size ranging from 0.75 to 4.5 μm with negative surface charge and narrow size distribution. Although particle size and encapsulation efficiency were increased by increasing the Pr:Ps ratio and core to wall ratio, the zeta-potential decreased. Vanillin/β-cyclodexterin loaded microcapsules had the maximum encapsulation efficiency about 85% at core to wall ratio of 1:3 and Pr:Ps ratio of 9:1. Structural studies by Fourier-transform infrared spectroscopy (FTIR) indicated the entrapment of encapsulant and X-Ray diffraction data and scanning electron microscopy (SEM) images showed that microcapsules have amorphous structure with soft surface. Furthermore, FTIR results indicated the formation of vanillin/β-cyclodextrin inclusion is the result of chemical interactions, but physical interaction between core and shell leads to encapsulate vanillin/β-cyclodextrin inclusion in rice bran protein-flaxseed gum (RBP-FG) coacervates. Microencapsulation increased the vanillin thermostability and its shelf life. Therefore, it is possible to increase thermal stability of vanillin against environmental conditions.
采用β-环糊精包合物共凝聚体制备香兰素包合物,以提高香兰素的热稳定性和控制释放。考察了蛋白质与多糖(Pr:Ps)的比例和芯材(香兰素/β-环糊精包合物)与壁材(共凝聚体)的比例对香兰素包埋率以及微胶囊的热性能、微观结构和物理特性的影响。微胶囊粒径为 0.75-4.5μm,带负电荷,粒径分布较窄。虽然随着 Pr:Ps 比例和芯壁比的增加,微胶囊的粒径和包封效率增加,但ζ电位降低。香兰素/β-环糊精包合物微胶囊的包封效率在芯壁比为 1:3 和 Pr:Ps 比为 9:1 时达到最大值,约为 85%。傅里叶变换红外光谱(FTIR)的结构研究表明包埋剂被包埋,X 射线衍射数据和扫描电子显微镜(SEM)图像表明微胶囊具有无定形结构,表面柔软。此外,FTIR 结果表明香兰素/β-环糊精包合物的形成是化学相互作用的结果,但芯材与壳材之间的物理相互作用导致香兰素/β-环糊精包合物被包埋在米糠蛋白-亚麻籽胶(RBP-FG)共凝聚体中。微胶囊化提高了香兰素的热稳定性和货架期。因此,可以提高香兰素对环境条件的热稳定性。