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在肖特基界面上用介孔 TiO-Cu 杂化纳米结构促进光解水制氢。

Promoting solar-to-hydrogen evolution on Schottky interface with mesoporous TiO-Cu hybrid nanostructures.

机构信息

School of Chemistry and Environmental Engineering, Wuhan Institute of Technology, Xiongchu Avenue, Wuhan 430073, China.

College of Chemistry and Chemical Engineering, Wuhan Textile University, Wuhan 430200, Hubei, China.

出版信息

J Colloid Interface Sci. 2019 Jun 1;545:116-127. doi: 10.1016/j.jcis.2019.03.007. Epub 2019 Mar 6.

Abstract

Developing a highly efficient photocatalysis system based on a photocatalyst-cocatalyst host for the hydrogen evolution reaction has potential but is still challenging. Herein, we report enhanced splitting of water achieved by loading copper metal particles on mesoporous TiO microrods through involving of dual ligand agents into the reaction system. The composition, structure, and surface characteristics of the TiO-Cu hybrid were analyzed by X-ray diffraction, X-ray photoelectron spectroscopy, scanning and transmission electron microscopy, and nitrogen adsorption. The formation of a Schottky contact in the interface between the Cu metal and the n-type semiconductor TiO was confirmed experimentally by photo/electrochemical measurements. This Schottky junction, the TiO-Cu hybrid photocatalyst, exhibited superior hydrogen evolution capability with rate of 6046 μmol g h, which is 23 times higher than that of pristine TiO (260 μmol g h). The experimental results demonstrated that efficient separation and transfer of photo-induced electron-hole pairs greatly contributed to the enhanced photocatalytic H evolution. The Schottky contact between Cu and TiO as well as cocatalyst characteristic of Cu play significant roles in preventing the recombination of electron-hole pairs and enhancing water splitting to form hydrogen. This study demonstrates a rational design to construct Schottky contacts in metal-semiconductor junctions to significantly boost their photocatalytic capacity.

摘要

开发基于光催化剂-共催化剂主体的高效光催化体系用于析氢反应具有潜力,但仍然具有挑战性。在此,我们通过将双配体试剂引入反应体系,在介孔 TiO 微米棒上负载铜金属颗粒,从而实现了水的高效分解。通过 X 射线衍射、X 射线光电子能谱、扫描和透射电子显微镜以及氮气吸附对 TiO-Cu 杂化材料的组成、结构和表面特性进行了分析。通过光电化学测量实验证实了 Cu 金属与 n 型半导体 TiO 之间界面处肖特基接触的形成。这种肖特基结,即 TiO-Cu 杂化光催化剂,表现出优异的析氢能力,其速率为 6046 μmol g h,比原始 TiO(260 μmol g h)高 23 倍。实验结果表明,光生电子空穴对的有效分离和转移极大地促进了增强的光催化 H 演化。Cu 和 TiO 之间的肖特基接触以及 Cu 的共催化剂特性在防止电子空穴对复合和增强水分解以形成氢气方面发挥了重要作用。本研究证明了一种合理的设计方法,用于构建金属-半导体结中的肖特基接触,从而显著提高其光催化能力。

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