使用Au⁻Ni⁻Pd⁻Ti高温钎料合金钎焊的SiC陶瓷接头的表征

Characterization of SiC Ceramic Joints Brazed Using Au⁻Ni⁻Pd⁻Ti High-Temperature Filler Alloy.

作者信息

He Huamin, Lu Chuanyang, He Yanming, Zheng Wenjian, Yang Jianguo, Wang Limei, Sun Yuan, Gao Zengliang

机构信息

Institute of Process Equipment and Control Engineering, Zhejiang University of Technology, Hangzhou 310014, China.

Department of Superalloy, Institute of Metal Research, Chinese Academy of Science, Shenyang 110016, China.

出版信息

Materials (Basel). 2019 Mar 20;12(6):931. doi: 10.3390/ma12060931.

DOI:10.3390/ma12060931

PMID:30897842

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC6470493/

Abstract

In this work, (AuNiPd₄)Ti₄ (wt.%) filler alloy was designed and employed to join SiC ceramics. The effects of brazing temperature and soaking time on the microstructure and fracture morphology of joints were investigated. The results show that the joint obtained can be described as SiC/reaction layer/braze/reaction layer/SiC. The reaction layer was composed of TiC and Au (Si, Ti). The wettability of the filler alloy toward the SiC ceramics was analyzed. The braze zone was mainly constituted by Pd₂Si, Ni₂Si, and Au (Ni, Si). A large number of nano-sized TiC particles were distributed within the Au (Ni, Si) layer. The formation mechanism of the braze containing different phases was discussed. The brazing temperature and soaking time had a significant effect on the reaction layer at the SiC/braze interface and TiC particles within the Au (Ni, Si) layer, while they showed a negligible effect on the Pd₂Si and Ni₂Si within the braze. The inherent reason was also clarified in detail. The joint fractography indicated that a good bonding was achieved between the filler alloy and SiC, while joint fracture was primarily induced by the thermal stresses residing after the brazing cycle.

摘要

在本工作中，设计并采用了（AuNiPd₄）Ti₄（重量百分比）填充合金来连接SiC陶瓷。研究了钎焊温度和保温时间对接头微观结构和断口形貌的影响。结果表明，所获得的接头可描述为SiC/反应层/钎料/反应层/SiC。反应层由TiC和Au（Si，Ti）组成。分析了填充合金对SiC陶瓷的润湿性。钎缝区主要由Pd₂Si、Ni₂Si和Au（Ni，Si）构成。大量纳米尺寸的TiC颗粒分布在Au（Ni，Si）层内。讨论了含不同相钎料的形成机制。钎焊温度和保温时间对SiC/钎料界面处的反应层以及Au（Ni，Si）层内的TiC颗粒有显著影响，而对钎缝内的Pd₂Si和Ni₂Si影响可忽略不计。其内在原因也进行了详细阐述。接头断口分析表明，填充合金与SiC之间实现了良好的结合，而接头断裂主要是由钎焊循环后残留的热应力引起的。