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使用Ti-Zr-Ni-Cu-Sn非晶态钎料对TC4合金进行钎焊

Brazing of TC4 Alloy Using Ti-Zr-Ni-Cu-Sn Amorphous Braze Fillers.

作者信息

Sun Zhan, Zhang Boyu, Li Degang, Zhu Xinxin, Chang Qing, Zhang Bo, Zhang Lixia, Long Weimin, Zhong Sujuan

机构信息

State Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin 150001, China.

State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou 450001, China.

出版信息

Materials (Basel). 2024 Jul 29;17(15):3745. doi: 10.3390/ma17153745.

Abstract

In order to address the issues of excessive brittle intermetallic compounds (IMC) formation in the TC4 brazed joints, two types of novel Ti-Zr-Cu-Ni-Sn amorphous braze fillers were designed. The microstructure and shear strength of the TC4/Ti-Zr-Ni-Cu-Sn/TC4 brazed joints were studied by scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffractometer (XRD) and electronic universal materials testing machine. The results show that the optimized TiZrNiCuSn braze filler whose chemical composition is closer to the eutectic point possesses a lower melting point compared with the equiatomic TiZrNiCuSn. This was beneficial to the sufficient diffusion of Cu and Ni elements with the base metal during brazing and reduces the residual (Ti,Zr)(Ni,Cu) content in the joint, which helps to improve the joint performance. The room-temperature and high-temperature shear strength of the TC4 brazed joints using the near eutectic component TiZrNiCuSn filler reached a maximum of 472 MPa and 389 MPa at 970 °C/10 min, which was 66% and 48% higher than that of the TC4 joints brazed with the equiatomic TiZrNiCuSn braze filler. Microstructural evolution and the corresponding mechanical response were in-depth discussed.

摘要

为了解决TC4钎焊接头中脆性金属间化合物(IMC)形成过多的问题,设计了两种新型的Ti-Zr-Cu-Ni-Sn非晶态钎料。采用扫描电子显微镜(SEM)、透射电子显微镜(TEM)、X射线衍射仪(XRD)和电子万能材料试验机对TC4/Ti-Zr-Ni-Cu-Sn/TC4钎焊接头的微观结构和剪切强度进行了研究。结果表明,与等原子比的TiZrNiCuSn相比,化学成分更接近共晶点的优化TiZrNiCuSn钎料熔点更低。这有利于钎焊过程中Cu和Ni元素与母材充分扩散,降低接头中残余(Ti,Zr)(Ni,Cu)含量,有助于提高接头性能。采用近共晶成分TiZrNiCuSn钎料的TC4钎焊接头在970℃/10min时的室温及高温剪切强度分别达到最大值472MPa和389MPa,比采用等原子比TiZrNiCuSn钎料钎焊的TC4接头分别提高了66%和48%。深入讨论了微观结构演变及相应的力学响应。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78be/11313286/1e8b36b1ff8c/materials-17-03745-g001.jpg

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