Opt Lett. 2019 Apr 1;44(7):1596-1599. doi: 10.1364/OL.44.001596.
A surface channel waveguide (WG) laser is produced by diamond saw dicing of a 15 μm thick 10 at. % Tm:KYGdLu(WO) monoclinic double tungstate thin film grown by liquid phase epitaxy on an undoped KY(WO) substrate. The WG propagation losses are 1.1±0.5 dB/cm. When pumped at 802 nm, laser operation is achieved with a maximum output power of 262 mW at 1833 nm with a record slope efficiency of 82.6% (versus the absorbed pump power) in a TE spatial mode (linear laser polarization, E‖N). Diamond saw dicing of double tungstate epitaxies is a promising technology for manufacturing WGs for sensing applications.
通过对液相外延在未掺杂 KY(WO)衬底上生长的 10 原子%Tm:KYGdLu(WO) 单斜双钨酸盐薄膜进行钻石锯切割，制作出了表面通道波导（WG）激光器。WG 的传播损耗为 1.1±0.5dB/cm。当以 802nm 进行泵浦时，在 TE 空间模式（线性激光偏振，E‖N）下，在 1833nm 处获得了 262mW 的最大输出功率，激光运转，记录的斜率效率为 82.6%（相对于吸收的泵浦功率）。对于传感应用，双钨酸盐外延的钻石锯切割是制造 WG 的一种很有前途的技术。
