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颗粒 V 型结晶淀粉的 CO 包合物:结构与释放动力学。

CO inclusion complexes of Granular V-type crystalline starch: Structure and release kinetics.

机构信息

School of Food Science and Engineering, Guangdong Province Key Laboratory for Green Processing of Natural Products and Product Safety, South China University of Technology, Guangzhou 510640, China.

School of Food Science and Engineering, Guangdong Province Key Laboratory for Green Processing of Natural Products and Product Safety, South China University of Technology, Guangzhou 510640, China; SCUT-Zhuhai Institute of Modern Industrial Innovation, Zhuhai, Guangdong 519175, China.

出版信息

Food Chem. 2019 Aug 15;289:145-151. doi: 10.1016/j.foodchem.2019.03.037. Epub 2019 Mar 12.

Abstract

Granular V-type crystalline starch (V-type starch) was prepared using different starch varieties by alcoholic-alkaline treatment. Carbon dioxide was encapsulated into V-type starch using a solid encapsulation method. The morphological and structural properties of the inclusion complexes (ICs) were characterised using scanning electron microscopy and X-ray diffraction. Fourier-transform infrared spectroscopy and C Nuclear Magnetic Resonance proved that CO was successfully encapsulated. The encapsulation capacity of V-type starches was determined by head space gas chromatography, and ICs made from normal maize starch achieved the highest CO concentration (2.55%, w/w). The controlled release characteristics of ICs were also determined at various temperatures and relative humidity, and ICs made from normal potato starch exhibited slower release characteristics. The release kinetics showed that the release of CO from ICs was accelerated by increasing temperature or RH. V-type starch is a renewable, inexpensive material for encapsulation of gasses such as CO.

摘要

采用醇碱法处理不同淀粉品种制备颗粒状 V 型结晶淀粉(V 型淀粉)。采用固态包埋法将二氧化碳包埋到 V 型淀粉中。采用扫描电子显微镜和 X 射线衍射对包合物(ICs)的形态和结构特性进行了表征。傅里叶变换红外光谱和 C 核磁共振证明 CO 成功被包埋。通过顶空气相色谱法测定了 V 型淀粉的包封能力,普通玉米淀粉制备的 ICs 达到了最高的 CO 浓度(2.55%,w/w)。还在不同温度和相对湿度下测定了 ICs 的控释特性,普通马铃薯淀粉制备的 ICs 表现出较慢的释放特性。释放动力学表明,通过升高温度或 RH 可以加速 CO 从 ICs 中的释放。V 型淀粉是一种可再生的、廉价的气体(如 CO)包埋材料。

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