• 文献检索
  • 文档翻译
  • 深度研究
  • 学术资讯
  • Suppr Zotero 插件Zotero 插件
  • 邀请有礼
  • 套餐&价格
  • 历史记录
应用&插件
Suppr Zotero 插件Zotero 插件浏览器插件Mac 客户端Windows 客户端微信小程序
定价
高级版会员购买积分包购买API积分包
服务
文献检索文档翻译深度研究API 文档MCP 服务
关于我们
关于 Suppr公司介绍联系我们用户协议隐私条款
关注我们

Suppr 超能文献

核心技术专利：CN118964589B侵权必究
粤ICP备2023148730 号-1Suppr @ 2026

文献检索

告别复杂PubMed语法，用中文像聊天一样搜索，搜遍4000万医学文献。AI智能推荐，让科研检索更轻松。

立即免费搜索

文件翻译

保留排版，准确专业，支持PDF/Word/PPT等文件格式，支持 12+语言互译。

免费翻译文档

深度研究

AI帮你快速写综述，25分钟生成高质量综述，智能提取关键信息，辅助科研写作。

立即免费体验

用于LED模块的激光微结构化散热增强

Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module.

作者信息

Lu Libin, Zhang Zhen, Guan Yingchun, Zheng Hongyu

机构信息

School of Mechanical Engineering & Automation, Beihang University, Beijing 100191, China.

State Key Laboratory of Tribology and Institute of Manufacturing Engineering, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China.

出版信息

Polymers (Basel). 2018 Aug 8;10(8):886. doi: 10.3390/polym10080886.

DOI:10.3390/polym10080886
PMID:30960811
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC6403799/
Abstract

Optimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-alloy heat sink. The heat dissipation performance was investigated by temperature evolution of a heat sink under natural convection by infrared (IR) camera, and results showed that the heat dissipation enhancement could be up to 25%. Moreover, the heat dissipation performance of a typical heat sink in terms of light-emitting diode (LED) hip was investigated via both thermal transient measurement and the finite element analysis (FEA). The maximum LED chip temperature of the laser-textured heat sink was approximately 22.4% lower than that of the as-received heat sink. We propose that these properties accompanied with the simplicity of fabrication make laser surface texturing a promising candidate for on-chip thermal management applications in electronics.

摘要

散热优化在集成电子器件的节能和高效利用方面发挥着重要作用。在本文中，我们展示了一项关于在聚合物基柔性基板上结合铝合金散热器进行微结构化的研究。通过红外（IR）相机对散热器在自然对流下的温度变化进行研究，考察了其散热性能，结果表明散热增强可达25%。此外，通过热瞬态测量和有限元分析（FEA）研究了典型的发光二极管（LED）芯片散热器的散热性能。激光纹理化散热器的LED芯片最高温度比原样散热器低约22.4%。我们认为，这些特性以及制造的简易性使激光表面纹理化成为电子芯片热管理应用中一个有前景的候选方案。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/0665dbd72765/polymers-10-00886-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/38ca047174ac/polymers-10-00886-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/13ecb9ee7fd1/polymers-10-00886-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/d47f4056cf90/polymers-10-00886-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/eaabfc1fc5c6/polymers-10-00886-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/20dad41b16f3/polymers-10-00886-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/697a3f74c09e/polymers-10-00886-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/f44349a5a02f/polymers-10-00886-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/0665dbd72765/polymers-10-00886-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/38ca047174ac/polymers-10-00886-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/13ecb9ee7fd1/polymers-10-00886-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/d47f4056cf90/polymers-10-00886-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/eaabfc1fc5c6/polymers-10-00886-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/20dad41b16f3/polymers-10-00886-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/697a3f74c09e/polymers-10-00886-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/f44349a5a02f/polymers-10-00886-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c3b5/6403799/0665dbd72765/polymers-10-00886-g008.jpg

相似文献

1
Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module.用于LED模块的激光微结构化散热增强
Polymers (Basel). 2018 Aug 8;10(8):886. doi: 10.3390/polym10080886.
2
High Thermal Dissipation of Al Heat Sink When Inserting Ceramic Powders by Ultrasonic Mechanical Coating and Armoring.通过超声机械涂层和铠装插入陶瓷粉末时铝散热器的高热耗散。
Materials (Basel). 2017 Apr 26;10(5):454. doi: 10.3390/ma10050454.
3
Heat Dissipation in Flexible Nitride Nanowire Light-Emitting Diodes.柔性氮化物纳米线发光二极管中的散热
Nanomaterials (Basel). 2020 Nov 16;10(11):2271. doi: 10.3390/nano10112271.
4
Thermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface.用于增强金属表面散热的热辐射氧化铜层
Nanomaterials (Basel). 2021 Oct 24;11(11):2819. doi: 10.3390/nano11112819.
5
Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler.使用高导热性填料的高亮度LED封装组件的散热性能
Appl Opt. 2013 Dec 10;52(35):8484-93. doi: 10.1364/AO.52.008484.
6
Research on Heat Dissipation of Multi-Chip LED Filament Package.多芯片LED灯丝封装散热研究
Micromachines (Basel). 2021 Dec 31;13(1):77. doi: 10.3390/mi13010077.
7
Finite Element Simulation of the Machining Process of Boiling Structures in a Novel Radial Heat Sink for High-Power LEDs.新型大功率LED径向散热器中沸腾结构加工过程的有限元模拟
Materials (Basel). 2020 Sep 7;13(18):3958. doi: 10.3390/ma13183958.
8
Enhancement of Natural Convection by Carbon Nanotube Films Covered Microchannel-Surface for Passive Electronic Cooling Devices.碳纳米管薄膜覆盖微通道表面增强自然对流用于无源电子冷却装置。
ACS Appl Mater Interfaces. 2016 Nov 16;8(45):31202-31211. doi: 10.1021/acsami.6b08815. Epub 2016 Nov 4.
9
Optimization of Heat-Dissipation Structure of High-Power Diode Laser in Space Environments.空间环境中高功率二极管激光器散热结构的优化
Micromachines (Basel). 2024 Jul 29;15(8):968. doi: 10.3390/mi15080968.
10
Increasing Heat Transfer from Metal Surfaces through Laser-Interference-Induced Microscopic Heat Sinks.通过激光干涉诱导微观热沉提高金属表面的热传递
Micromachines (Basel). 2023 Sep 2;14(9):1730. doi: 10.3390/mi14091730.

引用本文的文献

1
Impact of Thermal Dissipation on the Lighting Performance and Useful Life of LED Luminaires Applied to Urban Lighting: A Case Study.散热对应用于城市照明的 LED 灯具的照明性能和使用寿命的影响：案例研究。
Int J Environ Res Public Health. 2022 Jan 10;19(2):752. doi: 10.3390/ijerph19020752.
2
Fabrication of Micro-Structured LED Diffusion Plate Using Efficient Micro Injection Molding and Micro-Ground Mold Core.利用高效微注塑成型和微磨模具型芯制造微结构LED扩散板
Polymers (Basel). 2020 Jun 8;12(6):1307. doi: 10.3390/polym12061307.

本文引用的文献

1
Enhanced pool-boiling heat transfer and critical heat flux on femtosecond laser processed stainless steel surfaces.飞秒激光加工不锈钢表面上的强化池沸腾传热与临界热流密度
Int J Heat Mass Transf. 2015 Mar;82:109-116. doi: 10.1016/j.ijheatmasstransfer.2014.11.023. Epub 2014 Nov 28.
2
Controlling the Heat Dissipation in Temperature-Matched Plasmonic Nanostructures.控制温度匹配等离子体纳米结构中的散热。
Nano Lett. 2017 Sep 13;17(9):5472-5480. doi: 10.1021/acs.nanolett.7b02131. Epub 2017 Aug 4.
3
Enhancement of Natural Convection by Carbon Nanotube Films Covered Microchannel-Surface for Passive Electronic Cooling Devices.
碳纳米管薄膜覆盖微通道表面增强自然对流用于无源电子冷却装置。
ACS Appl Mater Interfaces. 2016 Nov 16;8(45):31202-31211. doi: 10.1021/acsami.6b08815. Epub 2016 Nov 4.
4
PDMS nanocomposites for heat transfer enhancement in microfluidic platforms.用于微流控平台中增强传热的聚二甲基硅氧烷纳米复合材料。
Lab Chip. 2014 Sep 7;14(17):3419-26. doi: 10.1039/c4lc00615a.
5
Efficient natural-convective heat transfer properties of carbon nanotube sheets and their roles on the thermal dissipation.碳纳米管片的高效自然对流换热特性及其在热散逸中的作用。
ACS Appl Mater Interfaces. 2014 Mar 12;6(5):3075-80. doi: 10.1021/am405491t. Epub 2014 Feb 20.
6
Graphene quilts for thermal management of high-power GaN transistors.用于高功率 GaN 晶体管热管理的石墨烯被子。
Nat Commun. 2012 May 8;3:827. doi: 10.1038/ncomms1828.