IEEE 802.11ac网络中通道绑定的吞吐量研究。
A Throughput Study for Channel Bonding in IEEE 802.11ac Networks.
作者信息
Kim Mun-Suk, Ropitault Tanguy, Golmie Nada, Lee Sukyoung
机构信息
National Institute of Standards and Technology, Gaithersburg, MD 20899 USA.
Yonsei University, Seoul 03722, South Korea.
出版信息
IEEE Commun Lett. 2017;21. doi: 10.1109/LCOMM.2017.2747511.
Several analytical models for the channel bonding feature of IEEE 802.11ac have previously been presented for performance estimation, but their accuracy has been limited by the assumptions that there are no collisions or all nodes are in saturated state. Therefore, in this letter, we develop an analytical model for the throughput performance of channel bonding in IEEE 802.11ac, considering the presence of collisions under both saturated and non-saturated traffic loads, and our numerical results were validated by a simulation study.
此前已经提出了几种用于IEEE 802.11ac信道绑定特性的分析模型来进行性能评估，但其准确性受到不存在冲突或所有节点都处于饱和状态这些假设的限制。因此，在本信函中，我们针对IEEE 802.11ac中信道绑定的吞吐量性能开发了一种分析模型，考虑了饱和和非饱和业务负载下的冲突情况，并且我们的数值结果通过仿真研究得到了验证。
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