Department of Medicine, Electrophysiology Service, Montreal Heart Institute, Université de Montréal, Montreal, Quebec, Canada.
Department of Medicine, Adult Congenital Heart Disease Center, Montreal Heart Institute, Université de Montréal, Montreal, Quebec, Canada.
JACC Clin Electrophysiol. 2019 Jun;5(6):671-680. doi: 10.1016/j.jacep.2019.01.023. Epub 2019 Mar 27.
This study sought to assess the feasibility, safety, and outcomes of a stepwise combined percutaneous approach that includes transvenous lead extraction (TLE) followed by baffle stenting and device reimplantation in patients with D-transposition of the great arteries (D-TGA) and atrial baffle dysfunction.
Management of baffle leak or stenosis in patients with D-TGA and atrial switch surgery is challenging in the presence of transvenous cardiac implantable electronic devices. Baffle complications hinder device-related interventions and addressing baffle dysfunction often requires TLE.
All consecutive patients with D-TGA and TLE followed by a percutaneous baffle intervention at the Montreal Heart Institute between 2009 and 2018 were enrolled.
Ten patients, median 38.6 years of age (range 15.2 to 50.6 years), 5 males (50.0%) were included. Procedures were performed for a device-related indication in 5 patients (50.0%) and for baffle dysfunction in 5 patients (50.0%). A total of 19 leads (17 pacing, 2 defibrillation) were targeted, with a median time from implantation of 8.7 (range 4.3 to 22.1) years. A laser sheath was most frequently required for successful TLE, which was achieved in all patients. Immediate baffle stenting was performed in 9 patients (90.0%) and immediate device reimplantation in 6 (60.0%). During a median follow-up of 3.0 (range 0.1 to 8.2) years, the only complication was subpulmonary atrioventricular valve damage requiring surgery in 1 patient, 8 months after the procedure.
A combined approach with TLE followed by baffle stenting and reimplantation appears to be safe and feasible in D-TGA patients with atrial switch, baffle dysfunction, and transvenous leads.
本研究旨在评估经静脉心脏植入式电子设备存在的情况下,分步联合经皮入路(包括经静脉导线拔除术[TLE],随后行心外膜补片支架置入术和器械再植入术)治疗完全性大动脉转位(D-TGA)和心外膜补片功能障碍患者的可行性、安全性和结局。
D-TGA 伴心房调转术后,心外膜补片漏或狭窄的管理具有挑战性,因为存在经静脉心脏植入式电子设备。心外膜补片并发症妨碍了器械相关介入,且处理心外膜补片功能障碍通常需要 TLE。
2009 年至 2018 年期间,所有在蒙特利尔心脏研究所接受 D-TGA 和 TLE 治疗后,行经皮心外膜补片介入治疗的连续患者均被纳入本研究。
10 例患者,中位年龄 38.6 岁(范围 15.2 至 50.6 岁),男性 5 例(50.0%)。5 例(50.0%)因器械相关适应证,5 例(50.0%)因心外膜补片功能障碍而行该手术。共定位 19 根导线(17 根起搏,2 根除颤),植入中位时间为 8.7 年(范围 4.3 至 22.1 年)。最常需要激光鞘来成功拔除 TLE,所有患者均成功拔除。9 例(90.0%)患者即刻行心外膜补片支架置入术,6 例(60.0%)患者即刻行器械再植入术。中位随访 3.0 年(范围 0.1 至 8.2 年)期间,仅 1 例患者在术后 8 个月发生亚肺静脉房室瓣损伤,需要手术治疗。
对于 D-TGA 伴心房调转、心外膜补片功能障碍和经静脉导线患者,经 TLE 联合心外膜补片支架置入术和器械再植入术的联合方法似乎是安全且可行的。