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水介导的表面扩散机制促成冷烧结过程:一项计算与实验相结合的研究

Water-Mediated Surface Diffusion Mechanism Enables the Cold Sintering Process: A Combined Computational and Experimental Study.

作者信息

Sengul Mert Y, Guo Jing, Randall Clive A, van Duin Adri C T

机构信息

Materials Research Institute, The Pennsylvania State University, University Park, PA, 16802, USA.

State Key Laboratory for Mechanical Behaviour of Materials, School of Materials Science and Engineering, Xi'an Jiaotong University, Xi'an, China.

出版信息

Angew Chem Int Ed Engl. 2019 Sep 2;58(36):12420-12424. doi: 10.1002/anie.201904738. Epub 2019 Jul 30.

Abstract

The cold sintering process (CSP) densifies ceramics at much lower temperatures than conventional sintering processes. Several ceramics and composite systems have been successfully densified under cold sintering. For the grain growth kinetics of zinc oxide, reduced activation energies are shown, and yet the mechanism behind this growth is unknown. Herein, we investigate these mechanisms in more detail with experiments and ReaxFF molecular dynamics simulations. We investigated the recrystallization of zinc cations under various acidic conditions and found that their adsorption to the surface can be a rate-limiting factor for cold sintering. Our studies show that surface hydroxylation in CSP does not inhibit crystallization; in contrast, by creating a surface complex, it creates an orders of magnitude acceleration in surface diffusion, and in turn, accelerates recrystallization.

摘要

冷烧结工艺(CSP)在比传统烧结工艺低得多的温度下使陶瓷致密化。几种陶瓷和复合材料体系已在冷烧结条件下成功实现致密化。对于氧化锌的晶粒生长动力学,其活化能降低,但其生长背后的机制尚不清楚。在此,我们通过实验和ReaxFF分子动力学模拟更详细地研究这些机制。我们研究了各种酸性条件下锌阳离子的再结晶,发现它们在表面的吸附可能是冷烧结的一个速率限制因素。我们的研究表明,CSP中的表面羟基化不会抑制结晶;相反,通过形成表面络合物,它使表面扩散加速了几个数量级,进而加速了再结晶。

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