通过传统热化学气相沉积法在铜纳米线上合成氮掺杂石墨烯以实现高效热导率和稳定性
Synthesis of Nitrogen-Doped Graphene on Copper Nanowires for Efficient Thermal Conductivity and Stability by Using Conventional Thermal Chemical Vapor Deposition.
作者信息
Park Minjeong, Ahn Seul-Ki, Hwang Sookhyun, Park Seongjun, Kim Seonpil, Jeon Minhyon
机构信息
Department of Nanoscience and Engineering, Center for Nano Manufacturing, Inje University, Gimhae 50834, Korea.
Department of Military Information Science, Gyeongju University, Gyeongju 38065, Korea.
出版信息
Nanomaterials (Basel). 2019 Jul 7;9(7):984. doi: 10.3390/nano9070984.
Cu nanowires (NWs) possess remarkable potential a slow-cost heat transfer material in modern electronic devices. However, Cu NWs with high aspect ratios undergo surface oxidation, resulting in performance degradation. A growth temperature of approximately <1000 °C is required for preventing the changing of Cu NW morphology by the melting of Cu NWs at over 1000 °C. In addition, nitrogen (N)-doped carbon materials coated on Cu NWs need the formation hindrance of oxides and high thermal conductivity of Cu NWs. Therefore, we investigated the N-doped graphene-coated Cu NWs (NG/Cu NWs) to enhance both the thermal conductivity and oxidation stability of Cu NWs. The Cu NWs were synthesized through an aqueous method, and ethylenediamine with an amine group induced the isotropic growth of Cu to produce Cu NWs. At that time, the amine group could be used as a growth source for the N-doped graphene on Cu NWs. To grow an N-doped graphene without changing the morphology of Cu NWs, we report a double-zone growth process at a low growth temperature of approximately 600 °C. Thermal-interface material measurements were conducted on the NG/Cu NWs to confirm their applicability as heat transfer materials. Our results show that the synthesis technology of N-doped graphene on Cu NWs could promote future research and applications of thermal interface materials in air-stable flexible electronic devices.
铜纳米线(NWs)作为一种低成本的热传输材料,在现代电子设备中具有巨大潜力。然而,高纵横比的铜纳米线会发生表面氧化,导致性能下降。为防止铜纳米线在超过1000°C时熔化而改变其形态,需要约<1000°C的生长温度。此外,包覆在铜纳米线上的氮(N)掺杂碳材料需要阻碍氧化物的形成以及铜纳米线具有高导热性。因此,我们研究了氮掺杂石墨烯包覆的铜纳米线(NG/Cu NWs),以提高铜纳米线的热导率和氧化稳定性。通过水相法合成了铜纳米线,带有胺基的乙二胺诱导铜的各向同性生长以制备铜纳米线。此时,胺基可作为铜纳米线上氮掺杂石墨烯的生长源。为了在不改变铜纳米线形态的情况下生长氮掺杂石墨烯,我们报道了在约600°C的低生长温度下的双区生长过程。对NG/Cu NWs进行了热界面材料测量,以确认它们作为热传输材料的适用性。我们的结果表明,铜纳米线上氮掺杂石墨烯的合成技术可以促进热界面材料在空气稳定的柔性电子设备中的未来研究和应用。
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