School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University , West Lafayette, Indiana 47907, United States.
Nano Lett. 2015 Mar 11;15(3):2024-30. doi: 10.1021/nl504889t. Epub 2015 Feb 6.
Highly conductive copper nanowires (CuNWs) are essential for efficient data transfer and heat conduction in wide ranging applications like high-performance semiconductor chips and transparent conductors. However, size scaling of CuNWs causes severe reduction in electrical and thermal conductivity due to substantial inelastic surface scattering of electrons. Here we report a novel scalable technique for low-temperature deposition of graphene around CuNWs and observe strong enhancement of electrical and thermal conductivity for graphene-encapsulated CuNWs compared to uncoated CuNWs. Fitting the experimental data with the theoretical model for conductivity of CuNWs reveals significant reduction in surface scattering of electrons at the oxide-free CuNW surfaces, translating into 15% faster data transfer and 27% lower peak temperature compared to the same CuNW without the graphene coating. Our results provide compelling evidence for improved speed and thermal management by adapting the Cu-graphene hybrid technology in future ultrascaled silicon chips and air-stable flexible electronic applications.
高导电性铜纳米线（CuNWs）对于高效的数据传输和热传导至关重要，广泛应用于高性能半导体芯片和透明导体等领域。然而，由于电子的非弹性表面散射，CuNWs 的尺寸缩小会导致其电导率和热导率严重降低。在这里，我们报告了一种用于低温沉积石墨烯环绕 CuNWs 的新型可扩展技术，并观察到石墨烯封装的 CuNWs 的电导率和热导率相比于未涂层的 CuNWs 有显著增强。通过将实验数据拟合到 CuNWs 电导率的理论模型中，我们发现氧化物自由的 CuNWs 表面的电子表面散射显著减少，这转化为与没有石墨烯涂层的相同 CuNW 相比，数据传输速度提高了 15%，峰值温度降低了 27%。我们的结果为通过采用 Cu-石墨烯混合技术来提高未来超缩硅芯片和空气稳定柔性电子应用的速度和热管理提供了有力的证据。
