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美国高粱协会群体中抗穗发芽的全基因组关联作图。

Genome-Wide Association Mapping of Grain Mold Resistance in the US Sorghum Association Panel.

出版信息

Plant Genome. 2019 Jun;12(2). doi: 10.3835/plantgenome2018.09.0070.

DOI:10.3835/plantgenome2018.09.0070
PMID:31290917
Abstract

Sorghum [ (L.) Moench] production in warm and humid regions is limited by grain mold disease, which can be caused by a complex of >40 pathogenic and opportunistic fungi. The identification of resistant plants within temperate-adapted germplasm is imperative for the development of better-adapted varieties. The performance of 331 accessions from the previously genotyped sorghum association panel (SAP) was evaluated in four tropical environments. Only 18 accessions showed low seed deterioration and high emergence rates. The resistant accessions showed high variation in seed tannin contents and panicle shape, indicating that grain mold resistance is not associated with a single phenotypic trait. Seed mycoflora analysis recovered pathogenic fungi , , and in both resistant and susceptible accessions. By genome-wide association scans using 268,289 single nucleotide polymorphisms (SNPs), we identified two loci associated with low seed deterioration and another associated with emergence rate. Candidate genes within these loci included one gene () and two genes ( and ) with domains associated with systemic acquired resistance, suggesting that resistance involved pathogen recognition and downstream signaling cascades. This study provides insight into the genetic control of grain mold resistance as well as valuable accessions for breeding programs in temperate environments.

摘要

高粱[(L.)Moench]在温暖潮湿地区的生产受到籽粒霉病的限制,这种疾病可能由超过 40 种病原真菌和机会性真菌引起。在温带适应性种质中鉴定抗性植物对于开发适应性更好的品种至关重要。对来自先前基因分型高粱关联面板(SAP)的 331 个品系在四个热带环境中的表现进行了评估。只有 18 个品系表现出低种子劣化和高发芽率。抗性品系的种子单宁含量和穗形状表现出高度变化,表明籽粒霉病抗性与单一表型特征无关。种子真菌区系分析在抗性和易感品系中均回收了病原真菌、和。通过使用 268,289 个单核苷酸多态性(SNP)进行全基因组关联扫描,我们鉴定出与低种子劣化和发芽率相关的两个位点。这些位点中的候选基因包括一个基因()和两个基因(和),它们具有与系统获得性抗性相关的结构域,这表明抗性涉及病原体识别和下游信号级联。本研究为了解籽粒霉病抗性的遗传控制以及温带环境下的育种计划提供了有价值的材料。

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