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基于安全溶胶-凝胶转变电解质的具有热可逆自保护行为的全印刷基板通用微型超级电容器。

All-Printed Substrate-Versatile Microsupercapacitors with Thermoreversible Self-Protection Behavior Based on Safe Sol-Gel Transition Electrolytes.

作者信息

Ma Shaoshuai, Shi Yunhui, Zhang Yan, Zheng Liting, Zhang Qian, Xu Xinhua

机构信息

School of Materials Science and Engineering , Tianjin University , Tianjin 300072 , P. R. China.

Tianjin Key Laboratory of Composite and Functional Materials , Tianjin 300072 , P. R. China.

出版信息

ACS Appl Mater Interfaces. 2019 Aug 21;11(33):29960-29969. doi: 10.1021/acsami.9b09498. Epub 2019 Aug 12.

DOI:10.1021/acsami.9b09498
PMID:31322337
Abstract

Thermal runaway has always been a significant safety issue that high-performance electronic devices urgently need to solve. These existing strategies are limited by the lack of reversibility and low conductivity. Here, we propose a novel thermoreversible self-protection microsupercapacitor (TS-MSC) based on a thermoresponsive polymer electrolyte to prevent thermal runaway. When heating above the low critical solution temperature (LCST), a gelation process occurs in the smart electrolyte and effectively inhibits the migration of ions, leading to a decreased specific capacitance and an increased internal resistance of the MSC. However, the electrolyte transforms to a solution state at room temperature in which ions can freely migrate. Benefiting by sol-gel transition of the smart electrolyte, the TS-MSCs can exhibit different electrochemical performances at elevated temperatures, demonstrating an active method of achieving thermoreversible and dynamic self-protection. In addition, 3D printing technology and substrate versatility provide an attractive method in the design of integrated micropower devices. Therefore, such functional TS-MSCs offer a promising strategy to solve the safety issues of the nowadays portable microelectronic devices.

摘要

热失控一直是高性能电子设备迫切需要解决的重大安全问题。这些现有策略受到缺乏可逆性和低导电性的限制。在此,我们提出了一种基于热响应聚合物电解质的新型热可逆自保护微型超级电容器(TS-MSC),以防止热失控。当加热到低临界溶解温度(LCST)以上时,智能电解质中会发生凝胶化过程,有效抑制离子迁移,导致MSC的比电容降低和内阻增加。然而,电解质在室温下转变为溶液状态,离子可以自由迁移。得益于智能电解质的溶胶-凝胶转变,TS-MSCs在高温下可表现出不同的电化学性能,展示了一种实现热可逆和动态自保护的有效方法。此外,3D打印技术和基板通用性为集成微功率器件的设计提供了一种有吸引力的方法。因此,这种功能性TS-MSCs为解决当今便携式微电子设备的安全问题提供了一种有前景的策略。

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