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分子自组装中的机械应力松弛

Mechanical stress relaxation in molecular self-assembly.

作者信息

Menou Lucas, Castelnovo Martin

机构信息

Univ Lyon, Ens de Lyon, Univ Claude Bernard, CNRS, Laboratoire de Physique, F-69342 Lyon, France.

出版信息

Soft Matter. 2019 Aug 14;15(30):6180-6189. doi: 10.1039/c9sm00761j. Epub 2019 Jul 22.

Abstract

Molecular self-assembly on a curved substrate leads to the spontaneous inclusion of topological defects in the growing bidimensional crystal, unlike assembly on a flat substrate. We propose in this work a quantitative mechanism for this phenomenon by using standard thin shell elasticity. The Gaussian curvature of the substrate induces large in-plane compressive stress as the surface grows, in particular at the rim of the assembly, and the addition of a single defect relaxes this mechanical stress. We found out that the value of azimuthal stress at the rim of the assembly determines the preferred directions for defect nucleation. These results are also discussed as a function of different defect combinations, like dislocations and grain boundaries or scars. In particular, the elastic model permits us to compare quantitatively the ability of various defects to relax mechanical stress. Moreover, these findings allow us to understand the progressive building-up of the typical disclination and grain boundary pattern observed for ground states of large 2D spherical crystals.

摘要

与在平坦基底上的组装不同,在弯曲基底上的分子自组装会导致在生长的二维晶体中自发出现拓扑缺陷。在这项工作中,我们通过使用标准薄壳弹性理论提出了一种针对这种现象的定量机制。随着表面生长,基底的高斯曲率会引起较大的面内压缩应力,特别是在组装体的边缘,而添加单个缺陷会缓解这种机械应力。我们发现组装体边缘的方位应力值决定了缺陷成核的优先方向。这些结果也作为不同缺陷组合(如位错、晶界或疤痕)的函数进行了讨论。特别是,弹性模型使我们能够定量比较各种缺陷缓解机械应力的能力。此外,这些发现使我们能够理解在大型二维球形晶体基态中观察到的典型位错和晶界图案的逐步形成过程。

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