Fernández-Toledano J-C, Rigaut C, Mastrangeli M, De Coninck J
Laboratory of Surface and Interfacial Physics (LPSI), University of Mons, 7000 Mons, Belgium.
Laboratory of Surface and Interfacial Physics (LPSI), University of Mons, 7000 Mons, Belgium.
J Colloid Interface Sci. 2020 Apr 1;565:449-457. doi: 10.1016/j.jcis.2020.01.054. Epub 2020 Jan 20.
The contact line pinning that appears in a flow coating process over substrates patterned with chemical or physical heterogeneities has been recently applied to deposit micro- and nanoparticles with great precision. However, the mechanism underlying pinning of a receding contact line at the nanoscale is not yet well understood. In the case of a contact line pinned at a chemical heterogeneity, we hypothesise that it is possible to establish a relation between the pinning time, the contact line velocity and the liquid/plate/heterogeneity affinity that can help to optimize particle deposition.
We use large-scale molecular dynamic (MD) simulations of a finite liquid bridge formed between two parallel, non-identical, smooth solid plates. The top plate slides relative to the bottom plate inducing a displacement of the four different contact lines of the liquid bridge. The introduction of a chemical heterogeneity on the bottom plate by modifying locally the liquid-solid affinity provokes the transient pinning of the contact line in contact with the bottom substrate. By means of this simple MD simulation, we can study the mechanism of contact line pinning and its relation with the liquid/heterogeneity affinity and the contact line velocity. Additionally, we compare this mechanism with the case of the receding contact line pinned on a physical heterogeneity (a simple step discontinuity).
We propose an analytical model that predicts the values of the dynamic contact angles in the general case of a capillary liquid bridge confined between two parallel plates with different wettabilities versus the relative velocity of the top plate. These predictions are successfully validated by the results of the large-scale MD simulations. The model allows thus to predict the value of the dynamic contact angles for the different contact lines of the system versus the relative speed of the moving plate. Once the chemical heterogeneity is introduced in the bottom plate, we show that when the receding contact line reaches the patch it remains temporarily pinned while the receding contact angle evolves with time. Once the receding angle reaches the value of the equilibrium contact angle of the patch, the receding contact line overcomes pinning. A geometrical model able to predict the pinning time is proposed and validated by our MD simulations. The pinning time depends not only on the relative plate velocity and plate wettability properties but also on the separation distance between the plates confining the capillary bridge. The model can consequently be used to select the substrate wettability or meniscus geometry suitable to impose the pinning time required for specific applications.
在对具有化学或物理异质性图案的基底进行流动涂覆过程中出现的接触线钉扎现象,最近已被用于高精度地沉积微米和纳米颗粒。然而,纳米尺度下后退接触线钉扎的潜在机制尚未得到很好的理解。在接触线钉扎于化学异质性处的情况下,我们假设可以建立钉扎时间、接触线速度与液体/平板/异质性亲和力之间的关系,这有助于优化颗粒沉积。
我们对在两个平行、不同且光滑的固体平板之间形成的有限液桥进行大规模分子动力学(MD)模拟。顶板相对于底板滑动,导致液桥的四条不同接触线发生位移。通过局部改变液固亲和力在底板上引入化学异质性,会引发与底部基底接触的接触线的瞬时钉扎。借助这个简单的MD模拟,我们可以研究接触线钉扎的机制及其与液体/异质性亲和力和接触线速度的关系。此外,我们将这种机制与钉扎在物理异质性(简单的阶跃不连续性)上的后退接触线的情况进行比较。
我们提出了一个分析模型,该模型预测了在具有不同润湿性的两个平行平板之间限制的毛细管液桥的一般情况下,动态接触角相对于顶板相对速度的值。这些预测通过大规模MD模拟的结果得到了成功验证。该模型因此能够预测系统不同接触线的动态接触角相对于移动平板相对速度的值。一旦在底板中引入化学异质性,我们表明当后退接触线到达斑块时,它会暂时被钉扎,而后退接触角随时间演变。一旦后退角达到斑块平衡接触角的值,后退接触线就会克服钉扎。提出了一个能够预测钉扎时间的几何模型,并通过我们的MD模拟进行了验证。钉扎时间不仅取决于平板的相对速度和平板润湿性特性,还取决于限制毛细管桥的平板之间的分离距离。因此,该模型可用于选择适合特定应用所需钉扎时间的基底润湿性或弯月面几何形状。