Yang Songtan, Kang Zhixin, Guo Tao
Guangdong Key Laboratory for Advanced Metallic Materials Processing, School of Mechanical & Automotive Engineering, South China University of Technology, 381 Wushan, Guangzhou 510640, People's Republic of China.
Nanotechnology. 2020 May 8;31(19):195710. doi: 10.1088/1361-6528/ab703e. Epub 2020 Jan 27.
A facile, low-cost and environmentally-friendly technique has been developed to prepare highly conductive copper-graphene nanosheet (Cu-GNS) composite coatings on ABS (Acrylonitrile-Butadiene-Styrene) substrate. The surface activation of ABS substrate was obtained by a chrome-free and palladium-free pretreatment consisting of molecular bonding. Before electroplating Cu, the homogeneous single Ag film on ABS surface was achieved by the electroless spray-plating process. In addition, the deposition of Cu and GNS increased in the coatings along with the current density increasing. Four-point-probe test confirmed that the resistivity of Cu coatings (0.08 mΩ mm) and Cu-GNS composite coatings (0.05 mΩ mm) was in the same order of magnitude as pure copper (0.0175 mΩ mm) at high current density. Meanwhile, comparing with the Cu coatings, the resistivity of Cu-GNS composite coatings was reduced by nearly 40% at the same current density. The conductive property was significantly improved owing to the deposition of GNS. Therefore, this work was expected to expand the method of polymer materials surface metallization.
已开发出一种简便、低成本且环保的技术，用于在丙烯腈-丁二烯-苯乙烯（ABS）基材上制备高导电铜-石墨烯纳米片（Cu-GNS）复合涂层。ABS基材的表面活化通过由分子键合组成的无铬无钯预处理实现。在电镀铜之前，通过化学镀喷镀工艺在ABS表面获得均匀的单银膜。此外，随着电流密度的增加，涂层中铜和GNS的沉积量也增加。四点探针测试证实，在高电流密度下，铜涂层（0.08 mΩ·mm）和铜-石墨烯纳米片复合涂层（0.05 mΩ·mm）的电阻率与纯铜（0.0175 mΩ·mm）处于同一数量级。同时，与铜涂层相比，在相同电流密度下，铜-石墨烯纳米片复合涂层的电阻率降低了近40%。由于石墨烯纳米片的沉积，导电性能得到显著改善。因此，这项工作有望拓展聚合物材料表面金属化的方法。
